Surface functionalization by RF plasma deposition of ethylene diamine, acrylonitrile, and acetonitrile

Surface rich in covalently-bonded amine groups have wide end use applications in biomaterials. This article describes functionalization of stainless steel (SS) surface with reactive chemical groups using RF-cold-plasma polymerization of ethylene diamine (ED), acrylonitrile (AN), and acetonitrile (Ac...

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Bibliographic Details
Published inJournal of applied polymer science Vol. 107; no. 3; pp. 1686 - 1695
Main Authors Jampala, Soujanya N, Sarmadi, M, Manolache, S, Denes, F.S
Format Journal Article
LanguageEnglish
Published Hoboken Wiley Subscription Services, Inc., A Wiley Company 05.02.2008
Wiley
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Summary:Surface rich in covalently-bonded amine groups have wide end use applications in biomaterials. This article describes functionalization of stainless steel (SS) surface with reactive chemical groups using RF-cold-plasma polymerization of ethylene diamine (ED), acrylonitrile (AN), and acetonitrile (AcN). The effect of RF plasma power and frequency (40 kHz and 13.56 MHz) on surface chemistry was investigated by electron spectroscopy for chemical analysis (ESCA) and FTIR. It was demonstrated that all the plasma-deposited films consist of secondary and tertiary amines, imines, and amides with a small concentration of nitrile groups present in AN plasma. Significant changes in ED, and AN plasma-induced molecular fragmentation occur as the plasma conditions are varied. However, AcN plasma polymer chemistry is observed to be independent of RF frequency. Films deposited at 13.56 MHz RF power in continuous mode have higher concentrations of C---N linkages, with maximum in ED plasma-polymerized films. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008
Bibliography:http://dx.doi.org/10.1002/app.27189
US Department of Agriculture - No. Hatch Grant S1026
istex:34122B7DC61AE3B87F05018534B46325A3944158
ArticleID:APP27189
ark:/67375/WNG-K1SM6VMP-S
ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0021-8995
1097-4628
DOI:10.1002/app.27189