Effect of substructure on intergranular cavitation at high temperature

Though it is well recognized that intergranular cavitation at high stress locations on grain boundaries during creep is the cause for poor creep ductility the mechanism for the formation of the high stress locations is not understood. Two high purity coppers (99.9 and 99.99%) and Al-5Mg cylindrical...

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Published inScripta metallurgica et materialia Vol. 31; no. 6; pp. 723 - 728
Main Authors Lim, L.C., Lu, H.H.
Format Journal Article
LanguageEnglish
Published Seoul Elsevier B.V 15.09.1994
Oxford Pergamon Press
New York, NY
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ISSN0956-716X
DOI10.1016/0956-716X(94)90217-8

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Summary:Though it is well recognized that intergranular cavitation at high stress locations on grain boundaries during creep is the cause for poor creep ductility the mechanism for the formation of the high stress locations is not understood. Two high purity coppers (99.9 and 99.99%) and Al-5Mg cylindrical creep specimens were tests to aid in developing a better understanding of this phenomenon. The copper specimens were tested in argon at 773K at either constant load or a strain rate of 8.3x10 exp -5 s exp -1 and the Al-5Mg samples were tested in air at constant stresses in the range 100 to 230 MPa at 523K. The data showed that microstructural features of 10 mu m or less can exert a large effect on the cavitation behavior. Also, the intersections of subgrain and grain boundaries are sites for cavity formation.
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ISSN:0956-716X
DOI:10.1016/0956-716X(94)90217-8