Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation

• Published in: IEEE transactions on electromagnetic compatibility Vol. 52; no. 2; pp. 346 - 356
• Main Authors: Wu, Tzong-Lin, Chuang, Hao-Hsiang, Wang, Ting-Kuang
• Format: Journal Article
• Language: English
• Published: New York IEEE 01.05.2010; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Capacitors; Circuit boards; Couplings; Decoupling; Electromagnetic bandgap (EBG); ground bounce noise (GBN); high-speed digital circuits; Impedance; Integrity; mixed-signal circuits; Noise; Packages; Polyimide resins; power integrity (PI); Printed circuits; Resonant frequency; simultaneously switching noises; Substrates; Transient analysis
• ISSN: 0018-9375; 1558-187X
• DOI: 10.1109/TEMC.2009.2039575

Mitigating power distribution network (PDN) noise is one of the main efforts for power integrity (PI) design in high-speed or mixed-signal circuits. Possible solutions, which are based on decoupling or isolation concept, for suppressing PDN noise on package or printed circuit board (PCB) levels are reviewed in this paper. Keeping the PDN impedance very low in a wide frequency range, except at dc, by employing a shunt capacitors, which can be in-chip, package, or PCB levels, is the first priority way for PI design. The decoupling techniques including the planes structure, surface-mounted technology decoupling capacitors, and embedded capacitors will be discussed. The isolation approach that keeps part of the PDN at high impedance is another way to reduce the PDN noise propagation. Besides the typical isolation approaches such as the etched slots and filter, the new isolation concept using electromagnetic bandgap structures will also be discussed.