An Aging-Degree Evaluation Method for IGBT Bond Wire with Online Multivariate Monitoring

• Published in: Energies (Basel) Vol. 12; no. 20; p. 3962
• Main Authors: Hu, Zilang, Ge, Xinglai, Xie, Dong, Zhang, Yichi, Yao, Bo, Dai, Jian, Yang, Fengbo
• Format: Journal Article
• Language: English
• Published: Basel MDPI AG 18.10.2019
• Subjects: Aging; aging-degree evaluation; Algorithms; Automation; Bonded joints; Bonding; Compressive properties; Computer simulation; Crack propagation; Feedback; Fracture mechanics; igbt bond wire; Internet; Monitoring; Multivariate analysis; neural network; Neural networks; online multivariate monitoring; Parameter identification; Parameters; Semiconductor devices; Semiconductors; Temperature; Thermal expansion; Transistors; Voltage; Voltage drop; Wire; Working conditions; United States > US
• ISSN: 1996-1073; 1996-1073
• DOI: 10.3390/en12203962

The aging fracture of bonding wire is one of the main reasons for failure of insulated gate bipolar transistor (IGBT). This paper proposes an online monitoring method for IGBT bonding wire aging that does not interfere with the normal operation of the IGBT module. A quantitative analysis of aging degree was first performed, and the results of multivariate and univariate monitoring were compared. Based on the relationship between the monitoring parameters and the aging of the IGBT bonding wire, gradual damage of the IGBT bond wire was implemented to simulate aging failure and obtain the aging data. Moreover, the change of junction temperature was considered to regulate monitoring parameters. Then, the aging degree was evaluated by an artificial neural network (ANN) algorithm. The experimental results showed the effectiveness of the proposed method.