Effect of the Deformation Temperature on the Shape-Memory Behavior of Epoxy Networks

• Published in: Macromolecular materials and engineering Vol. 295; no. 8; pp. 726 - 734
• Main Authors: Feldkamp, Diane M., Rousseau, Ingrid A.
• Format: Journal Article
• Language: English
• Published: Weinheim WILEY-VCH Verlag 11.08.2010; WILEY‐VCH Verlag; Wiley
• Subjects: Applied sciences; Cycles; Deformation; epoxy resins; Exact sciences and technology; Formability; High strength; Mechanical properties; Networks; Organic polymers; Physicochemistry of polymers; Programming; Properties and characterization; Shape memory; shape-memory polymers; stimuli-sensitive polymers; Strain; strain at break; thermal programming; shape-memory polymers; stimuli-sensitive polymers; strain at break; Elongation at fracture; Dynamic mechanical properties; Shape memory effect; Mechanical properties; Epoxy resin; thermal programming; epoxy resins; Experimental study
• ISSN: 1438-7492; 1439-2054; 1439-2054
• DOI: 10.1002/mame.201000035

The impact of the deformation conditions, specifically the temperature, on the shape‐memory behavior and characteristics of epoxy SMPs is studied. By simply varying the temperature during deformation (i.e., the programming step of the SM effect), the ultimate strain of the formulated epoxy was improved three‐ to five‐fold, thereby providing for an increased range of reachable deformation strains during SM thermo‐mechanical cycling. This research unveils newly developed epoxy‐based SMPs with improved deformability range and high strength with intrinsically good thermal and chemical stability. Shape‐memory epoxies with transformation temperatures up to 99 °C and capable of large deformations (up to 68%) are described. The range of achievable deformation is at least tripled by varying the thermal condition during the deformation stage of a shape‐memory cycle with no adverse effect to their excellent shape memory characteristics.