Preparation and Characterization of Electrospun Polyimide Microfibrous Mats with High Whiteness and High Thermal Stability from Organo-soluble Polyimides Containing Rigid-rod Moieties
A series of flexible and tough polyimide (PI) microfibrous mats (PI-1~PI-4) have been prepared via the one-step electrospinning procedure with the organo-soluble PI resins as the starting materials. For this purpose, four PI resins were first synthesized by the chemical imidization reaction from 2,2...
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Published in | Fibers and polymers Vol. 19; no. 8; pp. 1706 - 1714 |
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Main Authors | , , , , , , |
Format | Journal Article |
Language | English |
Published |
Seoul
The Korean Fiber Society
01.08.2018
Springer Nature B.V 한국섬유공학회 |
Subjects | |
Online Access | Get full text |
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Summary: | A series of flexible and tough polyimide (PI) microfibrous mats (PI-1~PI-4) have been prepared via the one-step electrospinning procedure with the organo-soluble PI resins as the starting materials. For this purpose, four PI resins were first synthesized by the chemical imidization reaction from 2,2′-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and four aromatic diamines containing rigid-rod moieties in their molecular skeletons, respectively. The PI resins derived from 6FDA and aromatic diamines, including PI-1 from 2-(4-aminophenyl)-5-aminobenzimidazole (APBI), PI-2 from 2-(4-aminophenyl)-5-aminobenzoxazole (APBO), PI-3 from 4,4′-diaminobenzanilide (DABA), and PI-4 from 2-chloro-4,4-diaminobenzanilide (Cl-DABA) exhibited good solubility in polar aprotic solvents, such as N-methyl-2-pyrrolidone (NMP) and
N,N
-dimethylacetamide (DMAc). Flexible and tough microfibrous mats were successfully prepared by a one-step electrospinning procedure from the PI/DMAc solution (solid content: 15–20 wt%; absolute viscosity: 8000–10000 mPa·s). The derived PI mats exhibited good whiteness according to the CIE Lab measurements with
W
(whiteness) values as high as 94.31,
L
(lightness) values higher than 94.00,
b
* (yellowness) values as low as 2.98 and yellow indices (YI) as low as 4.87. In addition, the prepared PI mats exhibited excellent thermal and dimensional stability with the glass transition temperatures (
T
g
) higher than 345 °C and linear coefficients of thermal expansion (CTE) as low as 27.8×10
-6
/K. |
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ISSN: | 1229-9197 1875-0052 |
DOI: | 10.1007/s12221-018-8270-4 |