EMIB and advanced substrate packaging technologies to enable heterogeneous integration (HI) applications

Abstract Heterogeneous chiplet integration has become a crucial performance enabler in the microelectronics industry by providing the flexibility of die disaggregation, and the ability to mix/match different IP blocks optimized on different Si nodes in a single package. It shows great potential in s...

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Bibliographic Details
Published inJapanese Journal of Applied Physics Vol. 63; no. 2; pp. 20803 - 20806
Main Authors Duan, Gang, Mahajan, Ravi, Manepalli, Rahul, Azimi, Hamid
Format Journal Article
LanguageEnglish
Published Tokyo IOP Publishing 29.02.2024
Japanese Journal of Applied Physics
Subjects
advanced substrates
Artificial intelligence
EMIB
heterogeneous integration
high performance computing
Machine learning
Packaging
Power efficiency
Substrates
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Summary:Abstract Heterogeneous chiplet integration has become a crucial performance enabler in the microelectronics industry by providing the flexibility of die disaggregation, and the ability to mix/match different IP blocks optimized on different Si nodes in a single package. It shows great potential in supercomputing, autonomous driving, artificial intelligence, and machine learning applications. With rising demand in high performance computing, the key focus in heterogeneous integration (HI) scaling has been to push interconnect density with increased bandwidth and improved power efficiency. In this paper, we provide an overview of embedded multi-interconnect bridge packaging technology scaling and discuss key considerations for advanced substrate packaging technologies to enable further HI applications.
Bibliography:JJAP-S1103668.R3
ISSN:0021-4922
1347-4065
DOI:10.35848/1347-4065/ad125a