Relationship between Tg of Polyimide Resin and Resist Sensitivity in Three-Component Chemically Amplified Polyimide Resist

In this paper, we have explained a relationship between the resist sensitivity and Tg of the base polymers in three-component chemically amplified polyimide resists. Three-component chemically amplified resists consist of a base polymer, a photoacid generator (PAG), and a dissolution inhibitor that...

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Bibliographic Details
Published inJournal of Photopolymer Science and Technology Vol. 37; no. 5; pp. 517 - 522
Main Authors Madokoro, Daiki, Takashima, Katsuaki, Tanaka, Susumu, Yamaoka, Kohei, Yuba, Tomoyuki, Horibe, Hideo
Format Journal Article
LanguageEnglish
Published The Society of Photopolymer Science and Technology(SPST) 25.06.2024
Subjects
Acid diffusion
Chemically amplified resist
Deprotection reaction
Polyimide resist
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Summary:In this paper, we have explained a relationship between the resist sensitivity and Tg of the base polymers in three-component chemically amplified polyimide resists. Three-component chemically amplified resists consist of a base polymer, a photoacid generator (PAG), and a dissolution inhibitor that is deprotected by acid. Three polyimide resins with different Tg or the novolac resin were used as the base polymer. The polyimide resist had lower resist sensitivity than the novolac resist. The UV light absorption of the base polymers hardly inhibited the photoreaction of PAG. The higher the Tg of the base polymer, the more the deprotection reaction and acid diffusion in the resist films were promoted. From these results, a negative correlation between the Tg of the base polymer and the resist sensitivity was discovered.
ISSN:0914-9244
1349-6336
DOI:10.2494/photopolymer.37.517