Direct fabrication of copper patterns by reactive inkjet printing
Reactive inkjet printing (RIP) was applied to fabricate arbitrary copper (Cu) patterns. RIP prints reactive inks which can provide desired materials after the reaction on a substrate. Here, Cu precursors and reducing agents were dissolved together in one solution as a printable ink instead of conven...
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| Published in | Current applied physics Vol. 13; no. 9; pp. 1870 - 1873 |
|---|---|
| Main Authors | , , |
| Format | Journal Article |
| Language | English |
| Published |
Elsevier B.V
01.11.2013
한국물리학회 |
| Subjects | |
| Online Access | Get full text |
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| Abstract | Reactive inkjet printing (RIP) was applied to fabricate arbitrary copper (Cu) patterns. RIP prints reactive inks which can provide desired materials after the reaction on a substrate. Here, Cu precursors and reducing agents were dissolved together in one solution as a printable ink instead of conventional Cu nanoparticle inks. The prepared reactive ink was applied to the RIP method to provide dot arrays, lines, and films of Cu. The synthesis of Cu was confirmed to occur successfully by thorough analysis. The RIP method can reduce the process cost and resolve critical drawbacks of the conventional inkjet printing such as a nozzle clogging problem. Furthermore, utilizing reactive precursor inks broadens the choice of materials that can be processed by inkjet printing.
•Arbitrary patterns of copper are fabricated by reactive inkjet printing (RIP).•RIP can resolve nozzle clogging and cost-efficiency problems of conventional inkjet.•RIP will accelerate the transfer of inkjet technology from research to industry. |
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| AbstractList | Reactive inkjet printing (RIP) was applied to fabricate arbitrary copper (Cu) patterns. RIP prints reactive inks which can provide desired materials after the reaction on a substrate. Here, Cu precursors and reducing agents were dissolved together in one solution as a printable ink instead of conventional Cu nanoparticle inks. The prepared reactive ink was applied to the RIP method to provide dot arrays, lines, and films of Cu. The synthesis of Cu was confirmed to occur successfully by thorough analysis. The RIP method can reduce the process cost and resolve critical drawbacks of the conventional inkjet printing such as a nozzle clogging problem. Furthermore, utilizing reactive precursor inks broadens the choice of materials that can be processed by inkjet printing.
•Arbitrary patterns of copper are fabricated by reactive inkjet printing (RIP).•RIP can resolve nozzle clogging and cost-efficiency problems of conventional inkjet.•RIP will accelerate the transfer of inkjet technology from research to industry. Reactive inkjet printing (RIP) was applied to fabricate arbitrary copper (Cu) patterns. RIP prints reactive inks which can provide desired materials after the reaction on a substrate. Here, Cu precursors and reducing agents were dissolved together in one solution as a printable ink instead of conventional Cu nanoparticle inks. The prepared reactive ink was applied to the RIP method to provide dot arrays, lines,and films of Cu. The synthesis of Cu was confirmed to occur successfully by thorough analysis. The RIP method can reduce the process cost and resolve critical drawbacks of the conventional inkjet printing such as a nozzle clogging problem. Furthermore, utilizing reactive precursor inks broadens the choice of materials that can be processed by inkjet printing. KCI Citation Count: 8 Reactive inkjet printing (RIP) was applied to fabricate arbitrary copper (Cu) patterns. RIP prints reactive inks which can provide desired materials after the reaction on a substrate. Here, Cu precursors and reducing agents were dissolved together in one solution as a printable ink instead of conventional Cu nanoparticle inks. The prepared reactive ink was applied to the RIP method to provide dot arrays, lines, and films of Cu. The synthesis of Cu was confirmed to occur successfully by thorough analysis. The RIP method can reduce the process cost and resolve critical drawbacks of the conventional inkjet printing such as a nozzle clogging problem. Furthermore, utilizing reactive precursor inks broadens the choice of materials that can be processed by inkjet printing. |
| Author | Kim, Kukjoo Ahn, Sung Il Choi, Kyung Cheol |
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| Cites_doi | 10.1021/la802182y 10.1016/j.orgel.2012.02.016 10.1006/jssc.2000.8802 10.1002/adma.200901141 10.1016/j.jcis.2007.03.039 10.1021/ja00063a006 10.1016/j.susc.2006.10.014 10.1021/cm9708269 10.1002/adma.200300385 10.1088/0957-4484/16/12/059 10.1002/marc.200400522 10.1088/0957-4484/19/41/415604 10.1039/jm9930300627 10.1016/j.matlet.2007.03.014 10.1021/cm0101632 10.1016/j.cap.2010.06.010 10.1080/15421400600930458 10.1016/j.tsf.2006.11.142 10.1002/adma.200701876 |
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| References | Lee, Choi, Lee, Stott, Kim (bib12) 2008; 19 Gans, Duineveld, Schubert (bib2) 2004; 16 Cha, Ahn, Choi (bib9) 2010; 10 Zhu, Zhang, Yin (bib17) 2005; 16 Ahn, Kim, Ryu, Kim, Lee, Kim, Park, Choi (bib10) 2012; 13 Lisiecki, Pileni (bib19) 1993; 115 Osch, Perelaer, Laat, Schubert (bib7) 2008; 20 Kim, Jeong, Moon, Kang (bib5) 2006; 459 Larcher, Patrice (bib13) 2000; 154 Park, Kim, Jeong, Moon, Kim (bib6) 2007; 515 Yang, Yang, Okamoto, Bessho, Satake, Ichino, Okido (bib16) 2006; 600 Woo, Kim, Kim, Lim, Moon (bib8) 2009; 25 Park, Jeong, Kim, Moon, Lim, Kim (bib11) 2007; 311 Khanna, Gaikwad, Adhyapak, Singh, Marimuthu (bib15) 2007; 61 Calvert (bib1) 2001; 13 Kamyshny, Ben-Moshe, Aviezer, Magdassi (bib4) 2005; 26 Dhas, Raj, Gedanken (bib18) 1998; 10 Singh, Haverinen, Dhagat, Jabbour (bib3) 2010; 22 Fievet, Fievet-Vincent, Lagier, Dumont, Figlarz (bib14) 1993; 3 Woo (10.1016/j.cap.2013.07.021_bib8) 2009; 25 Kim (10.1016/j.cap.2013.07.021_bib5) 2006; 459 Dhas (10.1016/j.cap.2013.07.021_bib18) 1998; 10 Calvert (10.1016/j.cap.2013.07.021_bib1) 2001; 13 Gans (10.1016/j.cap.2013.07.021_bib2) 2004; 16 Fievet (10.1016/j.cap.2013.07.021_bib14) 1993; 3 Ahn (10.1016/j.cap.2013.07.021_bib10) 2012; 13 Lee (10.1016/j.cap.2013.07.021_bib12) 2008; 19 Larcher (10.1016/j.cap.2013.07.021_bib13) 2000; 154 Park (10.1016/j.cap.2013.07.021_bib6) 2007; 515 Kamyshny (10.1016/j.cap.2013.07.021_bib4) 2005; 26 Park (10.1016/j.cap.2013.07.021_bib11) 2007; 311 Khanna (10.1016/j.cap.2013.07.021_bib15) 2007; 61 Zhu (10.1016/j.cap.2013.07.021_bib17) 2005; 16 Lisiecki (10.1016/j.cap.2013.07.021_bib19) 1993; 115 Cha (10.1016/j.cap.2013.07.021_bib9) 2010; 10 Singh (10.1016/j.cap.2013.07.021_bib3) 2010; 22 Yang (10.1016/j.cap.2013.07.021_bib16) 2006; 600 Osch (10.1016/j.cap.2013.07.021_bib7) 2008; 20 |
| References_xml | – volume: 10 start-page: 1446 year: 1998 end-page: 1452 ident: bib18 article-title: Synthesis, characterization, and properties of metallic copper nanoparticles publication-title: Chem. Mater. contributor: fullname: Gedanken – volume: 20 start-page: 343 year: 2008 end-page: 345 ident: bib7 article-title: Inkjet printing of narrow conductive tracks on untreated polymeric substrates publication-title: Adv. Mater. contributor: fullname: Schubert – volume: 515 start-page: 7706 year: 2007 end-page: 7711 ident: bib6 article-title: Direct writing of copper conductive patterns by ink-jet printing publication-title: Thin Solid Films contributor: fullname: Kim – volume: 459 start-page: 45 year: 2006 end-page: 55 ident: bib5 article-title: Ink-jet printing of silver conductive tracks on flexible substrates publication-title: Mol. Cryst. Liq. Cryst. contributor: fullname: Kang – volume: 61 start-page: 4711 year: 2007 end-page: 4714 ident: bib15 article-title: Synthesis and characterization of copper nanoparticles publication-title: Mater. Lett. contributor: fullname: Marimuthu – volume: 25 start-page: 429 year: 2009 end-page: 433 ident: bib8 article-title: Ink-jet printing of Cu–Ag-based highly conductive tracks on a transparent substrate publication-title: Langmuir contributor: fullname: Moon – volume: 13 start-page: 3299 year: 2001 end-page: 3305 ident: bib1 article-title: Inkjet printing for materials and devices publication-title: Chem. Mater. contributor: fullname: Calvert – volume: 26 start-page: 281 year: 2005 end-page: 288 ident: bib4 article-title: Ink-jet printing of metallic nanoparticles and microemulsions publication-title: Macromol. Rapid Comm. contributor: fullname: Magdassi – volume: 311 start-page: 417 year: 2007 end-page: 424 ident: bib11 article-title: Synthesis and size control of monodisperse copper nanoparticles by polyol method publication-title: J. Colloid Interface Sci. contributor: fullname: Kim – volume: 13 start-page: 980 year: 2012 end-page: 984 ident: bib10 article-title: OLED with a controlled molecular weight of the PVK (poly(9-vinylcarbazole)) formed by a reactive ink-jet process publication-title: Org. Electron contributor: fullname: Choi – volume: 3 start-page: 627 year: 1993 end-page: 632 ident: bib14 article-title: Controlled nucleation and growth of micrometre-size copper particles prepared by the polyol process publication-title: J. Mater. Chem. contributor: fullname: Figlarz – volume: 115 start-page: 3887 year: 1993 end-page: 3896 ident: bib19 article-title: Synthesis of copper metallic clusters using reverse micelles as microreactors publication-title: J. Am. Chem. Soc. contributor: fullname: Pileni – volume: 600 start-page: L318 year: 2006 end-page: L320 ident: bib16 article-title: Synthesis of copper monolayer and particles at aqueous-organic interface publication-title: Surf. Sci. contributor: fullname: Okido – volume: 19 start-page: 415604 year: 2008 ident: bib12 article-title: Large-scale synthesis of copper nanoparticles by chemically controlled reduction for applications of inkjet-printed electronics publication-title: Nanotechnology contributor: fullname: Kim – volume: 22 start-page: 673 year: 2010 end-page: 685 ident: bib3 article-title: Inkjet printing—process and its applications publication-title: Adv. Mater. contributor: fullname: Jabbour – volume: 16 start-page: 203 year: 2004 end-page: 213 ident: bib2 article-title: Inkjet printing of polymers: state of the art and future developments publication-title: Adv. Mater. contributor: fullname: Schubert – volume: 154 start-page: 405 year: 2000 end-page: 411 ident: bib13 article-title: Preparation of metallic powders and alloys in polyol media: a thermodynamic approach publication-title: J. Solid State Chem. contributor: fullname: Patrice – volume: 10 start-page: e109 year: 2010 end-page: e112 ident: bib9 article-title: An inkjet printing method: drop and synthesis (DAS). Application to the synthesis of ZnS:Mn nano-phosphor with a pattern publication-title: Curr. Appl. Phys. contributor: fullname: Choi – volume: 16 start-page: 3079 year: 2005 end-page: 3083 ident: bib17 article-title: Novel synthesis of copper nanoparticles: influence of the synthesis conditions on the particle size publication-title: Nanotechnology contributor: fullname: Yin – volume: 25 start-page: 429 year: 2009 ident: 10.1016/j.cap.2013.07.021_bib8 article-title: Ink-jet printing of Cu–Ag-based highly conductive tracks on a transparent substrate publication-title: Langmuir doi: 10.1021/la802182y contributor: fullname: Woo – volume: 13 start-page: 980 year: 2012 ident: 10.1016/j.cap.2013.07.021_bib10 article-title: OLED with a controlled molecular weight of the PVK (poly(9-vinylcarbazole)) formed by a reactive ink-jet process publication-title: Org. Electron doi: 10.1016/j.orgel.2012.02.016 contributor: fullname: Ahn – volume: 154 start-page: 405 year: 2000 ident: 10.1016/j.cap.2013.07.021_bib13 article-title: Preparation of metallic powders and alloys in polyol media: a thermodynamic approach publication-title: J. Solid State Chem. doi: 10.1006/jssc.2000.8802 contributor: fullname: Larcher – volume: 22 start-page: 673 year: 2010 ident: 10.1016/j.cap.2013.07.021_bib3 article-title: Inkjet printing—process and its applications publication-title: Adv. Mater. doi: 10.1002/adma.200901141 contributor: fullname: Singh – volume: 311 start-page: 417 year: 2007 ident: 10.1016/j.cap.2013.07.021_bib11 article-title: Synthesis and size control of monodisperse copper nanoparticles by polyol method publication-title: J. Colloid Interface Sci. doi: 10.1016/j.jcis.2007.03.039 contributor: fullname: Park – volume: 115 start-page: 3887 year: 1993 ident: 10.1016/j.cap.2013.07.021_bib19 article-title: Synthesis of copper metallic clusters using reverse micelles as microreactors publication-title: J. Am. Chem. Soc. doi: 10.1021/ja00063a006 contributor: fullname: Lisiecki – volume: 600 start-page: L318 year: 2006 ident: 10.1016/j.cap.2013.07.021_bib16 article-title: Synthesis of copper monolayer and particles at aqueous-organic interface publication-title: Surf. Sci. doi: 10.1016/j.susc.2006.10.014 contributor: fullname: Yang – volume: 10 start-page: 1446 year: 1998 ident: 10.1016/j.cap.2013.07.021_bib18 article-title: Synthesis, characterization, and properties of metallic copper nanoparticles publication-title: Chem. Mater. doi: 10.1021/cm9708269 contributor: fullname: Dhas – volume: 16 start-page: 203 year: 2004 ident: 10.1016/j.cap.2013.07.021_bib2 article-title: Inkjet printing of polymers: state of the art and future developments publication-title: Adv. Mater. doi: 10.1002/adma.200300385 contributor: fullname: Gans – volume: 16 start-page: 3079 year: 2005 ident: 10.1016/j.cap.2013.07.021_bib17 article-title: Novel synthesis of copper nanoparticles: influence of the synthesis conditions on the particle size publication-title: Nanotechnology doi: 10.1088/0957-4484/16/12/059 contributor: fullname: Zhu – volume: 26 start-page: 281 year: 2005 ident: 10.1016/j.cap.2013.07.021_bib4 article-title: Ink-jet printing of metallic nanoparticles and microemulsions publication-title: Macromol. Rapid Comm. doi: 10.1002/marc.200400522 contributor: fullname: Kamyshny – volume: 19 start-page: 415604 year: 2008 ident: 10.1016/j.cap.2013.07.021_bib12 article-title: Large-scale synthesis of copper nanoparticles by chemically controlled reduction for applications of inkjet-printed electronics publication-title: Nanotechnology doi: 10.1088/0957-4484/19/41/415604 contributor: fullname: Lee – volume: 3 start-page: 627 year: 1993 ident: 10.1016/j.cap.2013.07.021_bib14 article-title: Controlled nucleation and growth of micrometre-size copper particles prepared by the polyol process publication-title: J. Mater. Chem. doi: 10.1039/jm9930300627 contributor: fullname: Fievet – volume: 61 start-page: 4711 year: 2007 ident: 10.1016/j.cap.2013.07.021_bib15 article-title: Synthesis and characterization of copper nanoparticles publication-title: Mater. Lett. doi: 10.1016/j.matlet.2007.03.014 contributor: fullname: Khanna – volume: 13 start-page: 3299 year: 2001 ident: 10.1016/j.cap.2013.07.021_bib1 article-title: Inkjet printing for materials and devices publication-title: Chem. Mater. doi: 10.1021/cm0101632 contributor: fullname: Calvert – volume: 10 start-page: e109 year: 2010 ident: 10.1016/j.cap.2013.07.021_bib9 article-title: An inkjet printing method: drop and synthesis (DAS). Application to the synthesis of ZnS:Mn nano-phosphor with a pattern publication-title: Curr. Appl. Phys. doi: 10.1016/j.cap.2010.06.010 contributor: fullname: Cha – volume: 459 start-page: 45 year: 2006 ident: 10.1016/j.cap.2013.07.021_bib5 article-title: Ink-jet printing of silver conductive tracks on flexible substrates publication-title: Mol. Cryst. Liq. Cryst. doi: 10.1080/15421400600930458 contributor: fullname: Kim – volume: 515 start-page: 7706 year: 2007 ident: 10.1016/j.cap.2013.07.021_bib6 article-title: Direct writing of copper conductive patterns by ink-jet printing publication-title: Thin Solid Films doi: 10.1016/j.tsf.2006.11.142 contributor: fullname: Park – volume: 20 start-page: 343 year: 2008 ident: 10.1016/j.cap.2013.07.021_bib7 article-title: Inkjet printing of narrow conductive tracks on untreated polymeric substrates publication-title: Adv. Mater. doi: 10.1002/adma.200701876 contributor: fullname: Osch |
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| SubjectTerms | Arrays Copper Copper pattern Cost engineering COSTS FABRICATION Inkjet printing Inks nanoparticles Nozzle clogging Nozzles physics Plugging Precursors Reactive inkjet printing reducing agents 물리학 |
| Title | Direct fabrication of copper patterns by reactive inkjet printing |
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