Direct fabrication of copper patterns by reactive inkjet printing

• Published in: Current applied physics Vol. 13; no. 9; pp. 1870 - 1873
• Main Authors: Kim, Kukjoo, Ahn, Sung Il, Choi, Kyung Cheol
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 01.11.2013; 한국물리학회
• Subjects: Arrays; Copper; Copper pattern; Cost engineering; COSTS; FABRICATION; Inkjet printing; Inks; nanoparticles; Nozzle clogging; Nozzles; physics; Plugging; Precursors; Reactive inkjet printing; reducing agents; 물리학; Reactive inkjet printing; Copper pattern; Nozzle clogging
• ISSN: 1567-1739; 1878-1675
• DOI: 10.1016/j.cap.2013.07.021

Reactive inkjet printing (RIP) was applied to fabricate arbitrary copper (Cu) patterns. RIP prints reactive inks which can provide desired materials after the reaction on a substrate. Here, Cu precursors and reducing agents were dissolved together in one solution as a printable ink instead of conventional Cu nanoparticle inks. The prepared reactive ink was applied to the RIP method to provide dot arrays, lines, and films of Cu. The synthesis of Cu was confirmed to occur successfully by thorough analysis. The RIP method can reduce the process cost and resolve critical drawbacks of the conventional inkjet printing such as a nozzle clogging problem. Furthermore, utilizing reactive precursor inks broadens the choice of materials that can be processed by inkjet printing. •Arbitrary patterns of copper are fabricated by reactive inkjet printing (RIP).•RIP can resolve nozzle clogging and cost-efficiency problems of conventional inkjet.•RIP will accelerate the transfer of inkjet technology from research to industry.