Selective Laser Melting of CuSn10: Simulation of Mechanical Properties, Microstructure, and Residual Stresses

• Published in: Materials Vol. 15; no. 11; p. 3902
• Main Authors: Kremer, Robert, Khani, Somayeh, Appel, Tamara, Palkowski, Heinz, Foadian, Farzad
• Format: Journal Article
• Language: English
• Published: Switzerland MDPI AG 30.05.2022; MDPI
• Subjects: Additive manufacturing; Anisotropy; Ansys; CuSn10; Deformation; Diameters; FEM simulation; Grain size; Hole drilling method; Investigations; Laser beam melting; Lasers; Mechanical properties; Microstructure; Morphology; Particle size; Preferred orientation; Residual stress; residual stresses; selective laser melting; Simulation; Strain hardening; CuSn10; selective laser melting; microstructure; FEM simulation; Ansys; residual stresses
• ISSN: 1996-1944; 1996-1944
• DOI: 10.3390/ma15113902

In this study, the evolution of mechanical properties, microstructure, and residual stresses during selective laser melting of CuSn10 components was studied. To provide a proper material model for the simulations, various CuSn10 parts were manufactured using selective laser melting and examined. The manufactured parts were also used to validate the developed model. Subsequently, a sequentially coupled thermal-mechanical FEM model was developed using the Ansys software package. The developed model was able to deliver the mechanical properties, residual stresses, and microstructure of the additively manufactured components. Due to introducing some simplifications to the model, a calibration factor was applied to adjust the simulation results. However, the developed model was validated and showed a good agreement with the experimental results, such as measured residual stresses using the hole drilling method, as well as mechanical properties of manufactured parts. Moreover, the developed material model was used to simulate the microstructure of manufactured CuSn10. A fine-grain microstructure with an average diameter of 19 ± 11 μm and preferred orientation in the Z-direction, which was the assembly direction, was obtained.