A Comparison of Microtensile Bond Strength, Film Thickness, and Microhardness of Photo-Polymerized Luting Composites

The aim of this study was to evaluate the effect of CAD/CAM composite thickness on micro-tensile bond strength (µTBS), microhardness (HV), and film thickness (FT) of different luting composites. Composite blocks (6.8 mm × 6.8 mm) were divided into 12 groups according to: CAD/CAM thickness and luting...

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Bibliographic Details
Published inMaterials Vol. 15; no. 9; p. 3050
Main Authors El-Askary, Farid, Hassanein, Abdullah, Aboalazm, Emad, Al-Haj Husain, Nadin, Özcan, Mutlu
Format Journal Article
LanguageEnglish
Published Switzerland MDPI AG 22.04.2022
MDPI
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Summary:The aim of this study was to evaluate the effect of CAD/CAM composite thickness on micro-tensile bond strength (µTBS), microhardness (HV), and film thickness (FT) of different luting composites. Composite blocks (6.8 mm × 6.8 mm) were divided into 12 groups according to: CAD/CAM thickness and luting composite. For each group, 21 rods (1 mm × 1 mm) were tested in tension at crosshead speed of 1 mm/min. Fracture modes were categorized as adhesive, mixed, and cohesive. Microhardness (n = 5/group) was assessed using microhardness tester. Film thickness (12-rods/group) was evaluated using a stereomicroscope (×40). Data were analyzed using the two-way ANOVA/Tukey’s HSD test (p = 0.05). Parameters “thickness”, “cement”, and “thickness x cement” showed significant difference on µTBS and HV (p < 0.05). At 2 mm, heated x-tra fil composite showed the highest µTBS (45.0 ± 8.5 MPa), while at 4 mm thickness, Grandio Flow revealed the lowest µTBS (33.3 ± 6.3 MPa). Adhesive, mixed, and cohesive failures were reported. The HV of all composites decreased when photo-polymerized through 4 mm thickness (p < 0.05). Regardless of CAD/CAM thickness, photo-polymerized composites can be successfully used for luting CAD/CAM composite.
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Part of this study was presented virtually as a poster presentation at the Annual Meeting of the International Academy for Adhesive Dentistry (IAAD), 3–4 December 2021.
ISSN:1996-1944
1996-1944
DOI:10.3390/ma15093050