A comparative analysis of reticular crack on ceramic plate driven by thermal shock

• Published in: Science China. Physics, mechanics & astronomy Vol. 59; no. 7; pp. 46 - 51
• Main Authors: Xu, XiangHong, Sheng, ShiLong, Tian, Cheng, Yuan, WenJun
• Format: Journal Article
• Language: English
• Published: Beijing Science China Press 01.07.2016; Springer Nature B.V
• Subjects: Astronomy; Classical and Continuum Physics; Kilns; Observations and Techniques; Physics; Physics and Astronomy; Porcelain; Thermal shock; 冲击条件; 实验测试; 淬火温度; 热冲击; 网状裂纹; 陶瓷材料; 陶瓷板; 驱动; ceramics; reticular crack; Ge Kiln porcelain; thermal shock
• ISSN: 1674-7348; 1869-1927
• DOI: 10.1007/s11433-016-0098-2

Reticular crack is generally found on the surface of ceramic material that has been subjected to a thermal-shock condition. In the present study, a quantitative effect of thermal shock and quench temperature has been studied and investigated. Experimental tests were carried out to characterize the reticular crack that has been found in the Ge Kiln, which is a famous art of the ancient Chinese culture. After comparative analysis between thermal-shock cracks and the glaze crack patterns of the Ge Kiln porcelain, it is found that this study is expected to provide a powerful tool for recurrence of the long-lost firing and cooling process of the Ge Kiln porcelain.