Design and Fabrication of Ultra-Wideband Baluns Embedded in Multilayer Liquid Crystal Polymer Flex
In this paper, we present the design and fabrication of ultra-wideband (UWB) baluns embedded in multilayer liquid crystal polymer (LCP) flex. Fabrication techniques are demonstrated for processing these commercially available LCP thin-films by standard PCB equipments. Variations in the LCP thin-film...
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Published in | IEEE transactions on advanced packaging Vol. 30; no. 3; pp. 533 - 540 |
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Main Authors | , , |
Format | Journal Article |
Language | English |
Published |
Piscataway, NY
IEEE
01.08.2007
Institute of Electrical and Electronics Engineers The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
Online Access | Get full text |
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Summary: | In this paper, we present the design and fabrication of ultra-wideband (UWB) baluns embedded in multilayer liquid crystal polymer (LCP) flex. Fabrication techniques are demonstrated for processing these commercially available LCP thin-films by standard PCB equipments. Variations in the LCP thin-film thickness are characterized and compared before and after lamination. Results show good dimensional stability of the material, a critical factor in controlling the line impedances and performance of the balun. Electrical results of these baluns show bandwidths exceeding 3.1-10.6 GHz with less than 1 dB insertion loss, and amplitude and phase imbalance less than 1.2 dB and 2deg, respectively. These baluns are ideal for applications in UWB communication systems specified by the IEEE 802.15.3a standard. |
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Bibliography: | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 ObjectType-Article-2 ObjectType-Feature-1 |
ISSN: | 1521-3323 1557-9980 |
DOI: | 10.1109/TADVP.2007.901577 |