Miniaturized Bandpass Filters With Double-Folded Substrate Integrated Waveguide Resonators in LTCC
This paper proposes miniaturized bandpass filters with double-folded substrate integrated waveguide (SIW) resonators using multilayer low-temperature co-fired ceramic (LTCC) technology. Formed by inserting a metal plate with two orthogonal slots into the cavity, the double-folded SIW resonator is us...
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Published in | IEEE transactions on microwave theory and techniques Vol. 57; no. 7; pp. 1774 - 1782 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
New York, NY
IEEE
01.07.2009
Institute of Electrical and Electronics Engineers The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
Online Access | Get full text |
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Summary: | This paper proposes miniaturized bandpass filters with double-folded substrate integrated waveguide (SIW) resonators using multilayer low-temperature co-fired ceramic (LTCC) technology. Formed by inserting a metal plate with two orthogonal slots into the cavity, the double-folded SIW resonator is used for the circuit size reduction with its footprint about a quarter of the conventional TE 101 mode. With LTCC technology, there is more flexibility to organize the cavities of filters because of the 3-D arrangement. The vertically stacked cavities are coupled by ldquoLrdquo- or ldquoUrdquo-shaped slots, and if arranged horizontally, by an inductive window on the common sidewall or a suspended stripline between the cavities. Through experimental measurements and simulations at both the Ka - V -bands, it has been demonstrated that the proposed filter has compact sizes and good frequency responses. The area of the fully stacked Chebyshev filter has 88% size reduction in comparison with a three-pole planar waveguide filter, while the vertically stacked quasi-elliptic filter has 74% size reduction in comparison with a four-pole planar waveguide filter. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 14 content type line 23 |
ISSN: | 0018-9480 1557-9670 |
DOI: | 10.1109/TMTT.2009.2022591 |