A Miniaturized Multilayered Marchand Balun Using Coupled Artificial Transmission Lines

• Published in: IEEE microwave and wireless components letters Vol. 19; no. 7; pp. 446 - 448
• Main Authors: MA, Tzyh-Ghuang, CHENG, Yu-Ting
• Format: Journal Article
• Language: English
• Published: New York, NY IEEE 01.07.2009; Institute of Electrical and Electronics Engineers
• Subjects: Amplitudes; Applied sciences; Artificial transmission line (ATL); Asymmetry; Baluns; Bandwidth; Circuit properties; Circuit simulation; coupled line; Coupled mode analysis; Coupling circuits; Design engineering; Design methodology; Distributed parameter circuits; Electric variables; Electric, optical and optoelectronic circuits; Electronic circuits; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics; Electronics; Exact sciences and technology; Impedance matching; Marchand balun; Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits; Microwaves; Printed circuits; Signal convertors; Simulation; Transmission lines; Return loss; Coupled line; Multiple layer; Printed circuit board; Balun; Coupled transmission lines; Marchand balun; Transmission line; Asymmetry; Simulation; Printed circuit; Signal converter; Miniaturization; Artificial transmission line (ATL); Electrical characteristic
• ISSN: 1531-1309; 1558-1764
• DOI: 10.1109/LMWC.2009.2022126

A miniaturized Marchand balun is investigated in this letter. The Marchand balun is realized on a six-layered printed circuit board by integration of two coupled artificial transmission line sections. An additional artificial line is inserted in-between the coupled lines for compensating the asymmetry. With the help of the even odd mode analysis, the electrical characteristics of the coupled lines are investigated in detail. The proposed balun has the smallest occupied size among the previous designs on printed circuit boards. It features excellent amplitude and phase imbalance, and a comparable return loss bandwidth as well. The design methodology, simulation, and experimental results are introduced thoroughly in the letter.