Structured porous silicon sub-micrometer wells grown by colloidal lithography

Periodic porous silicon sub-micrometer wells embedded into a silicon matrix have been grown by a combination of colloidal lithography, plasma processing and electrochemical etching. The process relies on the formation of a self-assembled monolayer of polystyrene microspheres, which are etched in an...

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Bibliographic Details
Published inEurophysics letters Vol. 76; no. 4; pp. 690 - 695
Main Authors Silván, M. Manso, Hernández, M. Arroyo, Costa, V. Torres, Palma, R. J. Martín, Duart, J. M. Martínez
Format Journal Article
LanguageEnglish
Published IOP Publishing 01.11.2006
EDP Sciences
Subjects
81.05.Cy
81.05.Rm
85.40.Hp
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Summary:Periodic porous silicon sub-micrometer wells embedded into a silicon matrix have been grown by a combination of colloidal lithography, plasma processing and electrochemical etching. The process relies on the formation of a self-assembled monolayer of polystyrene microspheres, which are etched in an Ar/O2 plasma. A polymer resist is subsequently deposited by plasma polymerization. Finally, after colloidal particle removal, the surface is electrochemically etched in HF to form the porous silicon wells.
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content type line 23
ISSN:0295-5075
1286-4854
DOI:10.1209/epl/i2006-10331-2