AeroMEMS Wall Hot-Wire Anemometer on Polyimide Substrate Featuring Top Side or Bottom Side Bondpads

Design, manufacturing, calibration, and basic characterization of a microelectromechanical systems (MEMS) wall hot wire sensor on a flexible polyimide substrate are presented. A configuration exhibiting bond pads on the top side of the foil, as well as an improved setup featuring a through-foil meta...

Full description

Saved in:
Bibliographic Details
Published inIEEE sensors journal Vol. 7; no. 8; pp. 1095 - 1101
Main Authors Buder, U., Berns, A., Petz, R., Nitsche, W., Obermeier, E.
Format Journal Article
LanguageEnglish
Published New York IEEE 01.08.2007
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:Design, manufacturing, calibration, and basic characterization of a microelectromechanical systems (MEMS) wall hot wire sensor on a flexible polyimide substrate are presented. A configuration exhibiting bond pads on the top side of the foil, as well as an improved setup featuring a through-foil metallization and bottom side bond pads were established. Both sensor designs make use of a highly sensitive nickel thin-film resistor spanning a reactive ion etched cavity in a polyimide substrate. The polyimide base material enables the sensor to be adapted to curved aerodynamic surfaces, e.g., airfoils and turbine blades. A mismatch of curvature of aerodynamic surface and silicon sensor surface, as observed with previously presented MEMS hot-wire anemometers is avoided. The combination of polyimide's low thermal conductivity and a cavity featuring FEM-optimized dimensions accounts for a very low-power consumption (<25 mW). Fluctuations in wall shear stress up to 85 kHz can be resolved in constant-temperature mode. An average sensitivity of 0.166 V/(N/m 2 ) is achieved in a wall shear stress range from 0 to 0.72 N/m 2 . The specifically designed through-foil metallization process allows for electrical contacts to be positioned on the backside of the substrate, thus effectively minimizing aerodynamic disturbances.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:1530-437X
1558-1748
DOI:10.1109/JSEN.2007.897933