Hopping and Ionic Conduction in Tin Oxide-Based Thick-Film Resistor Compositions

Conduction mechanisms in tin oxide‐based thick‐film resistors have been investigated using impedance spectroscopic measurements. The sheet resistance, obtained by analyzing these impedance spectra, exhibits two regions of temperature dependence. The behavior in region I (room temperature to } 200°C)...

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Bibliographic Details
Published inJournal of the American Ceramic Society Vol. 80; no. 5; pp. 1198 - 1202
Main Authors Rahman, K. M. Anisur, Schneider, Susan C., Seitz, Martin A.
Format Journal Article
LanguageEnglish
Published Westerville, Ohio American Ceramics Society 01.05.1997
Blackwell
Subjects
Applied sciences
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Ionic conduction
Thick film resistor
Electrical properties
Tin oxide
Sheet resistance
Tin ion
Temperature effect
Resistor
Electrical impedance
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Summary:Conduction mechanisms in tin oxide‐based thick‐film resistors have been investigated using impedance spectroscopic measurements. The sheet resistance, obtained by analyzing these impedance spectra, exhibits two regions of temperature dependence. The behavior in region I (room temperature to } 200°C) can be explained satisfactorily in terms of variable‐range hopping conduction and in region II (200° to }350C) by a diffusion model. It is assumed that ionic tin dissolved in glass serves as the hopping sites in region I. At higher temperatures, these tin ions may participate in an ion‐exchange‐type diffusion that results in region II behavior.
Bibliography:istex:CA71DF80D83C8F3307C2E39A405176891118FF8A
ark:/67375/WNG-RBPGNCBX-S
ArticleID:JACE1198
T. O. Mason—contributing editor
Based in part on the thesis submitted by K. M. Anisur Rahman for the Ph.D. degree in Electrical and Computer Engineering, Marquette University, Milwaukee, WI, 1994.
Member, American Ceramic Society.
Presented in part at the 97th Annual Meeting of the American Ceramic Society, Cincinnati, OH, May 1, 1995 (Electronics and Glass Division, Paper No. SXXII–5–95).
ISSN:0002-7820
1551-2916
DOI:10.1111/j.1151-2916.1997.tb02964.x