Compact thermal networks for modeling packages

In this paper, thermal networks for modeling packages are rigorously introduced. A multipoint moment matching method for state space reduction of these discretized thermal networks is formulated. In this manner reduced thermal networks are derived that can be used as boundary condition independent c...

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Bibliographic Details
Published inIEEE transactions on components and packaging technologies Vol. 27; no. 1; pp. 96 - 103
Main Authors Codecasa, L., D'Amore, D., Maffezzoni, P.
Format Journal Article
LanguageEnglish
Published New York IEEE 01.03.2004
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Algorithm design and analysis
Algorithms
Arrays
Boundary conditions
Electronics packaging
Equations
Matching
Mathematical models
Networks
Packages
Packaging
Power generation
Shape
State-space methods
Temperature distribution
Thermal conductivity
Vectors
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ISSN1521-3331
1557-9972
DOI10.1109/TCAPT.2004.825796

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Summary:In this paper, thermal networks for modeling packages are rigorously introduced. A multipoint moment matching method for state space reduction of these discretized thermal networks is formulated. In this manner reduced thermal networks are derived that can be used as boundary condition independent compact thermal models of packages. This algorithm is successfully applied to the detailed analysis of an idealized ball grid array package.
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ISSN:1521-3331
1557-9972
DOI:10.1109/TCAPT.2004.825796