Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging

This paper describes a method to achieve rapid pressureless low-temperature sintering of Ag nanoparticles for bonding. Organic shells adsorbing on the surface of Ag nanoparticles to stabilize them were thinned to create a sparse protecting layer. The numerous coherent twin boundaries formed in sinte...

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Bibliographic Details
Published inScripta materialia Vol. 69; no. 11-12; pp. 789 - 792
Main Authors Wang, Shuai, Li, Mingyu, Ji, Hongjun, Wang, Chunqing
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.12.2013
Subjects
Ag nanoparticle
Bonding
Sintering
Thermal conductivity
Twinning
Thermal conductivity
Ag nanoparticle
Twinning
Bonding
Sintering
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Summary:This paper describes a method to achieve rapid pressureless low-temperature sintering of Ag nanoparticles for bonding. Organic shells adsorbing on the surface of Ag nanoparticles to stabilize them were thinned to create a sparse protecting layer. The numerous coherent twin boundaries formed in sintered Ag nanoparticles with a grain size of 21nm induce ultrahigh thermal conductivity (229Wm−1K−1), which overcomes the intrinsic defect that metals with nanosized grains generally exhibit a significantly reduced thermal conductivity because of the grain boundary scattering effect.
ISSN:1359-6462
1872-8456
DOI:10.1016/j.scriptamat.2013.08.031