Mechanical Characterization and Performance Optimization for GPU Fan-Sink Cooling Module Assembly

• Published in: IEEE transactions on electronics packaging manufacturing Vol. 30; no. 3; pp. 173 - 181
• Main Authors: CHEN, Ching-I, NI, Ching-Yu, LEE, Cheng-Chung, PAN, Hsin-Yu, YUAN, Tsorng-Dih
• Format: Journal Article
• Language: English
• Published: New York, NY IEEE 01.07.2007; Institute of Electrical and Electronics Engineers; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Applied sciences; Assembly; Clamps; Cooling; Design engineering; Design. Technologies. Operation analysis. Testing; Electronics; Exact sciences and technology; Fan-sink cooling module; Fasteners; finite element; graphic processing unit (GPU); Integrated circuits; Mathematical models; Modules; Optimization; Regression analysis; retention; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Soldering; Solders; Stresses; Thermal force; thermal interface material (TIM); Thermal resistance; Thermal stresses; Torque; Performance evaluation; Stress analysis; graphic processing unit (GPU); Thermal management (packaging); finite element; Solid solid interface; Thermal behavior; System design; thermal interface material (TIM); Numerical method; Optimization; Finite element method; Integrated circuit bonding; Fan; Stress distribution; Thermal resistance; Graphic processing unit; Fan-sink cooling module; First order; Soldered joint; Cooling system; Reliability; retention
• ISSN: 1521-334X; 1558-0822
• DOI: 10.1109/TEPM.2007.899147

Three GPU fan-sink cooling module assembly mounting mechanisms are mechanically characterized to determine the relationships between the clamping forces and screw torques. The first-order screw torque solutions are determined from the statistical regressions according to current industry recommendations. The screw tension force theoretical solution is derived for application to the finite-element model to assess the stress distributions on the thermal interface material (TIM) and solder joint layers by varying the retention sizes. The analysis results and stress differences are defined as the design objectives to optimize the retention design. Two optimized retentions are obtained from the characteristic stress difference curves accordingly. Through the thermal resistance measurement validation, the proposed retention designs improve the thermal performance to indicate less gap distance variation in the TIM. In addition, Better solder joint reliability can be obtained.