Laminated object manufacturing of LZSA glass-ceramics

• Published in: Rapid prototyping journal Vol. 17; no. 6; pp. 424 - 428
• Main Authors: Gomes, Cynthia, Travitzky, Nahum, Greil, Peter, Acchar, Wilson, Birol, Hansu, Pedro Novaes de Oliveira, Antonio, Hotza, Dachamir
• Format: Journal Article
• Language: English
• Published: Bradford Emerald Group Publishing Limited 01.01.2011
• Subjects: Ceramics; Crystallization; Density; Glass; Glass ceramics; Injection molding; Laminated object manufacturing; Laminates; LOM; Microelectronics; Particle size; Porosity; Sintering; Studies; Temperature; Thermal expansion; Thermal expansion; Laminated object manufacturing; Ceramics and glass; Dielectric properties
• ISSN: 1355-2546; 1758-7670
• DOI: 10.1108/13552541111184152

Purpose - This paper seeks to detail the fabrication of a glass-ceramic substrate, based on the LiO2-ZrO2-SiO2-Al2O3 (LZSA) system, by laminated object manufacturing (LOM) using water-based cast tapes.Design methodology approach - Small amounts of ZrSiO4 were added to control the thermal expansion coefficient (TEC) of the original glass-ceramic (LZSA5Zr: LZSA+5 wt% ZrSiO4). In order to verify the influence of the amount and nature of crystalline phases on the thermal and dielectric behavior of the material, LZSA and LZSA5Zr laminates were sintered at 700°C for 30 min and crystallized at either 800 or 850°C for 30 min.Findings - LZSA laminates (sintered and crystallized at 700 and 800°C, respectively) exhibited a relative density of ∼90 percent, a dielectric constant of 8.39, a dielectric loss tangent of 0.031 and TEC of 5.5×10−6 K−1 (25-550°C). The addition of 5 wt% ZrSiO4 to original LZSA glass-ceramics led to a nearly constant TEC value of 6×10−6 K−1 throughout the whole temperature interval (25-800°C). Dielectric properties of LZSA5Zr did not show any remarkable change when compared to original LZSA.Originality value - The thermal, mechanical and electrical properties of LZSA glass-ceramic laminates fabricated by LOM makes them potential candidates for substrate applications.