Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges

• Published in: Materials Vol. 14; no. 13; p. 3723
• Main Authors: Tsai, Ming-Yi, Wang, Yu-Wen, Liu, Chia-Ming
• Format: Journal Article
• Language: English
• Published: Basel MDPI AG 02.07.2021; MDPI
• Subjects: Cooling; Deformation; Finite element analysis; Finite element method; Integrated circuits; Mathematical models; Packages; Packaging; Shadows; Simulation; Strain gauges; Strain measurement; Thermal cycling; Thermal strain; Warpage
• ISSN: 1996-1944; 1996-1944
• DOI: 10.3390/ma14133723

The thermal warpage problems in integrated circuit (IC) packaging exist in both flip-chip and two-and-a-half dimensional integrated circuits (2.5D IC) packages during manufacturing processes and thermal cycling service. This study proposes a simple and easy-to-use strain gauge measurement associated...