Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges

• Published in: Materials Vol. 14; no. 13; p. 3723
• Main Authors: Tsai, Ming-Yi, Wang, Yu-Wen, Liu, Chia-Ming
• Format: Journal Article
• Language: English
• Published: Basel MDPI AG 02.07.2021; MDPI
• Subjects: Cooling; Deformation; Finite element analysis; Finite element method; Integrated circuits; Mathematical models; Packages; Packaging; Shadows; Simulation; Strain gauges; Strain measurement; Thermal cycling; Thermal strain; Warpage
• ISSN: 1996-1944; 1996-1944
• DOI: 10.3390/ma14133723

The thermal warpage problems in integrated circuit (IC) packaging exist in both flip-chip and two-and-a-half dimensional integrated circuits (2.5D IC) packages during manufacturing processes and thermal cycling service. This study proposes a simple and easy-to-use strain gauge measurement associated with a beam model theory to determine the thermally induced deformations and warpages of both packages. First, validation and limitations of the beam model theory are presented. Then, the thermally induced out-of-plane deformations for both packages are well described by the finite element method (FEM) simulation with a good consistency to full-field shadow moiré experimental results. The strain gauge measurements were implemented experimentally, and the thermal strain results were found to be well consistent with validated FEM ones. As a result, out-of-plane thermal deformations and warpages of the packages, calculated from the beam model theory with extracted curvature data from the strain gauge, were in reasonably good agreement with those from FEM analysis and shadow moiré measurements. Therefore, the strain gauge method of featuring point strain measurement combined with the beam model theory proved feasible in determining the thermal deformations and warpages of both IC packages.