Strain localization band width evolution by electronic speckle pattern interferometry strain rate measurement

In this paper, electronic speckle pattern interferometry strain rate measurements are used to quantify the width of the strain localization band, which occurs when a sheet specimen is submitted to tension. It is shown that the width of this band decreases with increasing strain. Just before fracture...

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Bibliographic Details
Published inScripta materialia Vol. 60; no. 8; pp. 647 - 650
Main Authors Guelorget, Bruno, François, Manuel, Montay, Guillaume
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.04.2009
Elsevier
Subjects
Copper
Electronic speckle pattern interferometry (ESPI)
Engineering Sciences
Localization
Mechanics
Mechanics of materials
Shear bands
Tension test
Copper
Localization
Electronic speckle pattern interferometry (ESPI)
Shear bands
Tension test
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Summary:In this paper, electronic speckle pattern interferometry strain rate measurements are used to quantify the width of the strain localization band, which occurs when a sheet specimen is submitted to tension. It is shown that the width of this band decreases with increasing strain. Just before fracture, this measured width is about five times wider than the shear band and the initial sheet thickness.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:1359-6462
1872-8456
DOI:10.1016/j.scriptamat.2008.12.036