Electroplating of Copper from an Amine based Noncyanide Bath

With a view to eliminating the use of toxic cyanide for electroplating copper, a non-cyanide alkaline bath, using triethanolamine as complexant, has been investigated. Various steps of bath developments are discussed in this paper. These include stability and immersion deposition characteristics of...

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Bibliographic Details
Published inTransactions of the Institute of Metal Finishing Vol. 79; no. 5; pp. 171 - 174
Main Authors Jayakrishnan, Sobha, Vinothini, A., Kala, C., Sriveeraraghavan, S., Krishnan, R.M.
Format Journal Article
LanguageEnglish
Published Birmingham Taylor & Francis 2001
Institute of Metal Finishing
Subjects
Applied sciences
Electroplating copper
Exact sciences and technology
Metallic coatings
Metals. Metallurgy
noncyanide bath
Production techniques
Surface treatment
triethanolamine
Plating bath
Metal coating
Amine
Complexing agent
Current efficiency
Electrodeposition
Chemical composition
Copper
Surface treatment
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Summary:With a view to eliminating the use of toxic cyanide for electroplating copper, a non-cyanide alkaline bath, using triethanolamine as complexant, has been investigated. Various steps of bath developments are discussed in this paper. These include stability and immersion deposition characteristics of solutions with varying concentrations, Hull cell experiments to arrive at a plating bath composition and determination of current efficiency and deposit nature under varying operating parameters to optimise the deposition conditions.
ISSN:0020-2967
1745-9192
DOI:10.1080/00202967.2001.11871389