Effects of Silver Microparticles and Nanoparticles on Thermal and Electrical Characteristics of Electrically Conductive Adhesives

• Published in: Journal of electronic materials Vol. 46; no. 11; pp. 6727 - 6735
• Main Authors: Zulkarnain, M., Fadzil, M. A., Mariatti, M., Azid, I. A.
• Format: Journal Article
• Language: English
• Published: New York Springer US 01.11.2017; Springer Nature B.V
• Subjects: Adhesion tests; Adhesives; Characterization and Evaluation of Materials; Chemistry and Materials Science; Conductivity; Electrical resistivity; Electronics and Microelectronics; Hybrid systems; Instrumentation; Insulation; Materials Science; Microparticles; Optical and Electronic Materials; Particulate composites; Silver; Solid State Physics; Thermal conductivity; electrically conductive adhesive (ECA); Thermal conductivity; particle structure; particle contact resistance
• ISSN: 0361-5235; 1543-186X
• DOI: 10.1007/s11664-017-5690-7

The effects of different volume fractions of silver (Ag) particles of different size (microsize, 2  μ m to 3.5  μ m diameter; nanosize, 80 nm diameter) on the thermal and electrical characteristics of epoxy–Ag electrically conductive adhesive (ECA) have been evaluated, as well as hybrid ECAs with both particle sizes at different ratios. Improved thermal and electrical conductivity resulted from the interaction between the particles, as evaluated by analysis of sample morphology. The interaction was altered to improve the conductivity. For both particle sizes, the electrical resistivity showed a transition from insulation to conduction at 6 vol.% Ag. In the hybrid system, the thermal conductivity decreased with increasing microparticle filler ratio. The electrical conductivity of the hybrid composite increased at 50:50 weight ratio.