Thermoplastic polyolefin based polymer – blend-layered double hydroxide nanocomposites

Layered double hydroxides (LDHs) are a new class of promising nanomaterials which improve the physicochemical properties of the polymer matrix. The present work deals with the preparation of nanocomposites of ethylene vinyl acetate (EVA-28)/low density polyethylene (LDPE) blend (1:1 by wt.) with var...

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Bibliographic Details
Published inComposites science and technology Vol. 68; no. 15; pp. 3234 - 3239
Main Authors Kuila, T., Srivastava, S.K., Bhowmick, A.K., Saxena, A.K.
Format Journal Article
LanguageEnglish
Published Kidlington Elsevier Ltd 01.12.2008
Elsevier
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Summary:Layered double hydroxides (LDHs) are a new class of promising nanomaterials which improve the physicochemical properties of the polymer matrix. The present work deals with the preparation of nanocomposites of ethylene vinyl acetate (EVA-28)/low density polyethylene (LDPE) blend (1:1 by wt.) with varying amounts of organomodified layered double hydroxide (DS-LDH) by solution blending. Transmission electron microscopy (TEM) and X-ray diffraction (XRD) have been used to find out the dispersion of Mg–Al nanolayers in EVA/LDPE blend. This confirms complete exfoliation of Mg–Al nanolayers in EVA-28/LDPE/DS-LDH nanocomposites. The measurements of mechanical properties of these nanocomposites show maximum tensile strength for 3 wt.% of DS-LDH content. However, elongation at break for the nanocomposites remains lower for entire filler loading with respect to neat EVA/LDPE blend. Thermogravimetric analysis shows successive improvement in the thermal stability behavior of the nanocomposites with increasing the concentration of DS-LDH. The limiting oxygen index values are also improved with increasing DS-LDH concentration. Swelling property measurement shows that solvent resistance properties of the nanocomposites are better at low filler loading.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
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content type line 23
ISSN:0266-3538
1879-1050
DOI:10.1016/j.compscitech.2008.08.003