Influence of eccentricity on the frequency limitations of circular-pad via-holes

• Published in: IEEE microwave and wireless components letters Vol. 14; no. 6; pp. 265 - 267
• Main Authors: Kouzaev, G.A., Deen, M.J., Nikolova, N.K., Rahal, A.H.
• Format: Journal Article
• Language: English
• Published: New York, NY IEEE 01.06.2004; Institute of Electrical and Electronics Engineers
• Subjects: Applied sciences; Circuit simulation; Circularity; Computational modeling; Eccentricity; Eigenvalues; Eigenvalues and eigenfunctions; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics; Electronics; Equations; Exact sciences and technology; Frequency bands; Frequency estimation; Grounding; Magnetic resonance; Mathematical analysis; Mathematical models; Microwaves; Resonant frequencies; Resonant frequency; Ultra wideband technology; Passive component; Frequency shift; Eccentricity; Resonance frequency; Linear transformation; Eigenvalue; passive components; Alignment defect; Modeling; via-holes; Via hole
• ISSN: 1531-1309; 1558-1764
• DOI: 10.1109/LMWC.2004.828015

We study the influence of the technologically caused eccentricity of a circular-pad via-hole. We derive an eigenvalue equation using a rigorous method based on a linear transformation of the via-hole polar coordinates. The eigenvalue equation is used to compute the modal resonant frequencies and the modal fields of the eccentric via. It is shown that the via-hole misalignment shifts the modal frequencies and influences its frequency band. The proposed model is verified with published experimental data, and is also compared with results generated with the full-wave simulator Agilent Momentum-2002.