Self-Assembled Electrical Contact to Nanoparticles Using Metallic Droplets

Self‐assembly of nanoparticles on liquid‐metal droplets (see image) provides a simple, effective approach to electronic devices with nanoscale control of the metal/nanoparticle junctions. This approach enables the inexpensive fabrication of a large number of devices and deposition on large‐area subs...

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Published inSmall (Weinheim an der Bergstrasse, Germany) Vol. 5; no. 17; pp. 1974 - 1977
Main Authors Du, Kan, Knutson, Christopher R., Glogowski, Elizabeth, McCarthy, Kevin D., Shenhar, Roy, Rotello, Vincent M., Tuominen, Mark T., Emrick, Todd, Russell, Thomas P., Dinsmore, Anthony D.
Format Journal Article
LanguageEnglish
Published Weinheim WILEY-VCH Verlag 04.09.2009
WILEY‐VCH Verlag
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Summary:Self‐assembly of nanoparticles on liquid‐metal droplets (see image) provides a simple, effective approach to electronic devices with nanoscale control of the metal/nanoparticle junctions. This approach enables the inexpensive fabrication of a large number of devices and deposition on large‐area substrates.
Bibliography:ark:/67375/WNG-XZ01QQW8-K
We acknowledge support from the NSF-supported NIRT (CTS-0609107), the Materials Research Science and Engineering Center on Polymers (DME-0213695), the Center for UMass/Industry Research on Polymers, and NSF grants DMR-0306951, DMI-0103024 and CHE 0518487. ADD gratefully acknowledges support from the Research Corporation Cottrell Scholarship Program and a UMass Faculty Research Grant.
NSF - No. DMR-0306951; No. DMI-0103024; No. CHE 0518487
ArticleID:SMLL200900203
istex:FA48FCA6365F3364E6D820702E1842E60A24612C
We acknowledge support from the NSF‐supported NIRT (CTS‐0609107), the Materials Research Science and Engineering Center on Polymers (DME‐0213695), the Center for UMass/Industry Research on Polymers, and NSF grants DMR‐0306951, DMI‐0103024 and CHE 0518487. ADD gratefully acknowledges support from the Research Corporation Cottrell Scholarship Program and a UMass Faculty Research Grant.
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ISSN:1613-6810
1613-6829
DOI:10.1002/smll.200900203