Influence of electrochemical properties on electrochemical migration of SnPb and SnBi solders
SnPb solders have been widely used in many fields because of their excellent solderability. To respond to environmental and health concerns regarding SnPb solders, it is necessary to develop lead-free solder for electronic assembly. In this paper, the resistance to the electrochemical migration of e...
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| Published in | Metals and materials international Vol. 16; no. 5; pp. 739 - 745 |
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| Main Authors | , |
| Format | Journal Article |
| Language | English |
| Published |
Springer
The Korean Institute of Metals and Materials
01.10.2010
Springer Nature B.V 대한금속·재료학회 |
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| Online Access | Get full text |
| ISSN | 1598-9623 2005-4149 |
| DOI | 10.1007/s12540-010-1007-6 |
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| Abstract | SnPb solders have been widely used in many fields because of their excellent solderability. To respond to environmental and health concerns regarding SnPb solders, it is necessary to develop lead-free solder for electronic assembly. In this paper, the resistance to the electrochemical migration of eutectic SnPb and SnBi solder alloys was evaluated and analyzed to detect the difference in the electrochemical migration behavior between these solders by their electrochemical properties. Pb and Bi additions to a Sn-base solder improved the resistance to electrochemical migration because of enhanced polarization properties. The resistance was closely related to the cathodic deposition efficiency and the anodic dissolution behavior. In addition, the composition of the dendrite formed by the electrochemical migration was related to the standard electrode potential of the alloying element. |
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| AbstractList | SnPb solders have been widely used in many fields because of their excellent solderability. To respond to environmental and health concerns regarding SnPb solders, it is necessary to develop lead-free solder for electronic assembly. In this paper, the resistance to the electrochemical migration of eutectic SnPb and SnBi solder alloys was evaluated and analyzed to detect the difference in the electrochemical migration behavior between these solders by their electrochemical properties. Pb and Bi additions to a Sn-base solder improved the resistance to electrochemical migration because of enhanced polarization properties. The resistance was closely related to the cathodic deposition efficiency and the anodic dissolution behavior. In addition, the composition of the dendrite formed by the electrochemical migration was related to the standard electrode potential of the alloying element. SnPb solders have been widely used in many fields because of their excellent solderability. To respond to environmental and health concerns regarding SnPb solders, it is necessary to develop lead-free solder for electronic assembly. In this paper, the resistance to the electrochemical migration of eutectic SnPb and SnBi solder alloys was evaluated and analyzed to detect the difference in the electrochemical migration behavior between these solders by their electrochemical properties. Pb and Bi additions to a Sn-base solder improved the resistance to electrochemical migration because of enhanced polarization properties. The resistance was closely related to the cathodic deposition efficiency and the anodic dissolution behavior. In addition, the composition of the dendrite formed by the electrochemical migration was related to the standard electrode potential of the alloying element. KCI Citation Count: 14 |
| Author | Yoo, Y. R. Kim, Y. S. |
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| Keywords | corrosion soldering electrochemical migration electronic materials electrical resistivity |
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| Snippet | SnPb solders have been widely used in many fields because of their excellent solderability. To respond to environmental and health concerns regarding SnPb... |
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| SubjectTerms | Alloys Characterization and Evaluation of Materials Chemistry and Materials Science Dendritic structure Deposition Engineering Thermodynamics Eutectics Heat and Mass Transfer Lead (metal) Machines Magnetic Materials Magnetism Manufacturing Materials Science Metallic Materials Migration Processes Solders Solid Mechanics 재료공학 |
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| Title | Influence of electrochemical properties on electrochemical migration of SnPb and SnBi solders |
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