Influence of electrochemical properties on electrochemical migration of SnPb and SnBi solders

• Published in: Metals and materials international Vol. 16; no. 5; pp. 739 - 745
• Main Authors: Yoo, Y. R., Kim, Y. S.
• Format: Journal Article
• Language: English
• Published: Springer The Korean Institute of Metals and Materials 01.10.2010; Springer Nature B.V; 대한금속·재료학회
• Subjects: Alloys; Characterization and Evaluation of Materials; Chemistry and Materials Science; Dendritic structure; Deposition; Engineering Thermodynamics; Eutectics; Heat and Mass Transfer; Lead (metal); Machines; Magnetic Materials; Magnetism; Manufacturing; Materials Science; Metallic Materials; Migration; Processes; Solders; Solid Mechanics; 재료공학; corrosion; soldering; electrochemical migration; electronic materials; electrical resistivity
• ISSN: 1598-9623; 2005-4149
• DOI: 10.1007/s12540-010-1007-6

SnPb solders have been widely used in many fields because of their excellent solderability. To respond to environmental and health concerns regarding SnPb solders, it is necessary to develop lead-free solder for electronic assembly. In this paper, the resistance to the electrochemical migration of eutectic SnPb and SnBi solder alloys was evaluated and analyzed to detect the difference in the electrochemical migration behavior between these solders by their electrochemical properties. Pb and Bi additions to a Sn-base solder improved the resistance to electrochemical migration because of enhanced polarization properties. The resistance was closely related to the cathodic deposition efficiency and the anodic dissolution behavior. In addition, the composition of the dendrite formed by the electrochemical migration was related to the standard electrode potential of the alloying element.