Optical imaging applied to microelectronic chip-to-chip interconnections

An imaging system is proposed as an alternative to metallized connections between integrated circuits. Power requirements for metallized interconnects and electrooptic links are compared. A holographic optical element is considered as the imaging device. Several experimental systems have been constr...

Full description

Saved in:
Bibliographic Details
Published inApplied optics (2004) Vol. 24; no. 17; p. 2851
Main Authors Kostuk, R K, Goodman, J W, Hesselink, L
Format Journal Article
LanguageEnglish
Published United States 01.09.1985
Online AccessGet more information

Cover

More Information
Summary:An imaging system is proposed as an alternative to metallized connections between integrated circuits. Power requirements for metallized interconnects and electrooptic links are compared. A holographic optical element is considered as the imaging device. Several experimental systems have been constructed which have visible LEDs as the transmitters and PIN photodiodes as the receivers. Signals are evaluated at different source-detector separations. Multiple exposure holograms are used as a means of optical fan out allowing one source to simultaneously address several receiver locations. Limitations of this technique are also discussed.
ISSN:1559-128X
2155-3165
DOI:10.1364/AO.24.002851