An overview on packaging of microwave electronic devices operating in a cryogenic environment

► Adeguate joint stress control required by cryogenic MMICs. ► Low CTE alloys had been proven to house MMICs. ► Flexible adhesive had been tested. Microwave cryogenic electronics design involves not only electrical, RF and electromagnetically considerations but also mechanical and assembly aspects....

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Bibliographic Details
Published inCryogenics (Guildford) Vol. 52; no. 10; pp. 445 - 451
Main Authors Cremonini, Andrea, Mariotti, Sergio, Roda, Juri
Format Journal Article
LanguageEnglish
Published Kidlington Elsevier Ltd 01.10.2012
Elsevier
Subjects
Applied sciences
Assembly
Cryogenic packaging
Cryogenics
Design engineering
Devices
Electronics
Energy
Energy. Thermal use of fuels
Exact sciences and technology
Housing
InP
LNA
Microwaves
MMIC
Packaging
Radioastronomy
Refrigerating engineering. Cryogenics. Food conservation
Working conditions
Cryogenic packaging
InP
Radioastronomy
LNA
MMIC
Sensitivity
Cooling
Cryogenics
Microwave
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Summary:► Adeguate joint stress control required by cryogenic MMICs. ► Low CTE alloys had been proven to house MMICs. ► Flexible adhesive had been tested. Microwave cryogenic electronics design involves not only electrical, RF and electromagnetically considerations but also mechanical and assembly aspects. Details heavily influence the final device performances. Radio astronomical science often requires cooling down front end parts of the receivers in order to increase the system sensitivity. In this paper we will introduce the device working environment, crucial aspects of the housing, and we will describe a variety of possible solutions.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:0011-2275
1879-2235
DOI:10.1016/j.cryogenics.2012.04.020