Equipment deterioration modeling and cause diagnosis in semiconductor manufacturing

• Published in: International journal of intelligent systems Vol. 36; no. 6; pp. 2618 - 2638
• Main Authors: Rostami, Hamideh, Blue, Jakey, Chen, Argon, Yugma, Claude
• Format: Journal Article
• Language: English
• Published: New York Hindawi Limited 01.06.2021
• Subjects: Batch processes; Batch processing; Condition monitoring; Correlation analysis; Decomposition; Deterioration; equipment deterioration; fault detection and ‎classification; Intelligent systems; Modelling; Search algorithms; smart manufacturing; wavelet decomposition
• ISSN: 0884-8173; 1098-111X
• DOI: 10.1002/int.22395

Condition‐based monitoring (CBM) as a new control scheme suggests characterizing the machine condition and triggering the corresponding control actions. CBM includes prognostic and diagnostic modules. In this study, the framework of equipment deterioration modeling and monitoring for batch processes is proposed with two objectives in the semiconductor industry. The first one is to characterize equipment behavior by exploiting the temporal data of batch processes. The second one is to model the deterioration trend with the most related causes. With the best‐fitted mother wavelet, wavelet packet decomposition transforms the temporal data into macro and micro level domains to identify two types of deterioration. The determinant of the correlation matrix of the decomposed signals is calculated as the equipment condition, and the factors that account for the deterioration are identified through a stepwise searching algorithm. A case study shows that the proposed methodology can identify influencing factors and model deterioration.