Issues and Perspectives for Giga to Tera Scale Integration

• Published in: Journal of Photopolymer Science and Technology Vol. 11; no. 3; pp. 373 - 378
• Main Author: Hirose, Masataka
• Format: Journal Article
• Language: English
• Published: Hiratsuka The Society of Photopolymer Science and Technology(SPST) 1998; Japan Science and Technology Agency
• Subjects: information technology; MOSFET scaling; self-assembled quantum dot; silicon nanodevices; ultra large scale integrated circuits
• ISSN: 0914-9244; 1349-6336
• DOI: 10.2494/photopolymer.11.373

The emerging multimedia era will need more advanced, ultra large scale integrated systems as open platforms for wide variety of information technology. Progress in design and manufacturing technology of ultra large scale integrated circuits (ULSI) now makes it possible to realize giga-scale integration of transistors on a single silicon chip, and even sub-terascale integrated systems are in the scope of advanced research. The information technology has dramatically changed the infrastructure of our society supported by computer and telecommunication systems, and simultaneously the network society starts to face a kind of language barrier inherently existing in the communication system such as the internet. In order to solve this problem a new paradigm of advanced research for computer architecture as well as the related integrated systems and devices is thought to be necessary. Particularly in device research, not only continuous downscaling of transistor dimensions for enhancing the integration level of ULSI but also extensive development of silicon-based quantum nanodevices and their implementation to integrated circuits will be needed for the advancement of language-barrier-free information network in future.