Acoustic backing in 3-D integration of CMUT with front-end electronics

• Published in: IEEE transactions on ultrasonics, ferroelectrics, and frequency control Vol. 59; no. 7; pp. 1537 - 1549
• Main Authors: Berg, Sigrid, Rønnekleiv, Arne
• Format: Journal Article
• Language: English
• Published: United States IEEE 01.07.2012; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Acoustics; Acoustics - instrumentation; Adhesive bonding; Arrays; Backing; Bonding; Computer-Aided Design; Electric Capacitance; Electronics - instrumentation; Equipment Design; Equipment Failure Analysis; Fluids; Fusion bonding; Image Enhancement - instrumentation; Image Interpretation, Computer-Assisted - instrumentation; Micro-Electrical-Mechanical Systems - instrumentation; Miniaturization; Phantoms, Imaging; Silicon; Silicon substrates; Substrates; Surface impedance; Three dimensional; Transducers; Ultrasonography - instrumentation
• ISSN: 0885-3010; 1525-8955
• DOI: 10.1109/TUFFC.2012.2353

Capacitive micromachined ultrasonic transducers (CMUTs) have shown promising qualities for medical imaging. However, there are still some problems to be investigated, and some challenges to overcome. Acoustic backing is necessary to prevent SAWs excited in the surface of the silicon substrate from affecting the transmit pattern from the array. In addition, echoes resulting from bulk waves in the substrate must be removed. There is growing interest in integrating electronic circuits to do some of the beamforming directly below the transducer array. This may be easier to achieve for CMUTs than for traditional piezoelectric transducers. We will present simulations showing that the thickness of the silicon substrate and thicknesses and acoustic properties of the bonding material must be considered, especially when designing high-frequency transducers. Through simulations, we compare the acoustic properties of 3-D stacks bonded with three different bonding techniques; solid-liquid interdiffusion (SLID) bonding, direct fusion bonding, and anisotropic conductive adhesives (ACA). We look at a CMUT array with a center frequency of 30 MHz and three silicon wafers underneath, having a total silicon thickness of 100 μm. We find that fusion bonding is most beneficial if we want to prevent surface waves from damaging the array response, but SLID and ACA are also promising if bonding layer thicknesses can be reduced.