Characterization of the surface structural, mechanical, and thermal properties of benzocyclobutene dielectric polymers using scanned probe microscopy

• Published in: Macromolecular symposia. Vol. 167; no. 1; pp. 213 - 226
• Main Authors: Meyers, Gregory F., Dineen, Michael T., Shaffer II, Edward O., Stokich Jr, Ted, Im, Jang-hi
• Format: Journal Article
• Language: English
• Published: Weinheim WILEY-VCH Verlag GmbH 01.03.2001; WILEY‐VCH Verlag GmbH
• Subjects: Adhesive strength; Density; Electronics; Imaging; Polymers; Resins; Thermal properties
• ISSN: 1022-1360; 1521-3900
• DOI: 10.1002/1521-3900(200103)167:1<213::AID-MASY213>3.0.CO;2-D

Scanning probe microscopy (SPM) techniques are used to characterize surfaces related to the processing of benzocyclobutene (BCB) dielectric thin films. Thermally cured resins and photodefineable resins are sold under the trade name CYLCOTENETM1) for electronic applications. TappingMode AFM (TMAFM) imaging is used to follow changes in adhesion promoter morphology upon baking to help explain adhesion performance. Power spectral density (PSD) analysis of TMAFM images of plasma treated BCB surfaces are unique and can be used to ‘fingerprint’ processes. Selective oxidation of the BCB surface can be used to fabricate a phase imaging standard for TMAFM. Near surface modulus of the BCB materials is 3.6 ± 0.2 GPa and the hardness is 0.38 ± 0.2 GPa measured by depth‐sensing nanoindentation. Creep recovery of indents can be used to qualitatively distinguish between thermal and photocureable materials. A heated tip in a scanning thermal microscope can induce the thermal curing of BCB over micron sized areas. Local thermal analysis with the same probe allows the measurement of the changes in the glass transition, Tg, at the surface with cure temperature.