Preparation Process of Epoxy Resin Microcapsules for Self - healing Coatings

The average particle size of the microcapsules can be reduced to 55.7 μm after optimization. Microcapsules showed good thermal stability with the thermal stability temperature of about 250 oC. The coating with 2% microcapsules shows the best performance, while its service life was prolonged by about...

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Bibliographic Details
Published inProgress in organic coatings Vol. 132; pp. 440 - 444
Main Authors Jialan, Yao, Chenpeng, Yang, Chengfei, Zhu, Baoqing, Hou
Format Journal Article
LanguageEnglish
Published Lausanne Elsevier B.V 01.07.2019
Elsevier BV
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Summary:The average particle size of the microcapsules can be reduced to 55.7 μm after optimization. Microcapsules showed good thermal stability with the thermal stability temperature of about 250 oC. The coating with 2% microcapsules shows the best performance, while its service life was prolonged by about 4 times. The self-healing microcapsules were prepared by in-situ polymerization with urea formaldehyde resin and epoxy resin E-5l as the wall material and core material separately in this paper. The effects of the amount of epoxy resin, sodium dodecyl benzene sulfonate (SDBS), ammonium chloride, resorcinol and the stirring rate on the particle size of microcapsules were discussed. The microcapsules were added into the epoxy resin composite coating for corrosion resistance evaluation. The results showed that when the ratio of epoxy resin to urea was 24%, the amount of SDBS was 8%, the amount of ammonium chloride was 5.6%, the content of resorcinol was 10.4% and the stirring speed was 450 rpm, the average particle size of the capsules was 55.7 μm. When the addition number of microcapsules was 2% in the coating, the corrosion resistance was best with its service life prolonged by about 4 times.
ISSN:0300-9440
1873-331X
DOI:10.1016/j.porgcoat.2019.04.015