Inductively Coupled Plasma Reactive Ion Etching of GeSbTe Thin Films in a HBr/Ar Gas

• Published in: Integrated ferroelectrics Vol. 90; no. 1; pp. 95 - 106
• Main Authors: LEE, JANG WOO, CHO, HAN NA, MIN, SU RYUN, CHUNG, CHEE WON
• Format: Journal Article
• Language: English
• Published: Taylor & Francis Group 19.04.2007
• Subjects: GeSbTe; HBr; inductively coupled plasma; reactive ion etching
• ISSN: 1058-4587; 1607-8489
• DOI: 10.1080/10584580701249371

Inductively coupled plasma reactive ion etching of GeSbTe (GST) thin films with a photoresist mask was performed using a HBr/Ar gas mixture. The etch rate of GST films increased up to 20% HBr concentration and began to decrease with further increase of HBr concentration. The etch profiles were improved with increasing HBr gas concentration. In particular, clean and vertical etch profiles were achieved at 80∼ 100% HBr gas concentrations. As the coil rf power and dc-bias voltage increased, the etch rates increased. The gas pressure had little influence on the etch rate. The good etch profiles were obtained at high coil power, low dc-bias and high gas pressure. The x-ray photoelectron spectroscopy analysis reveals that Te showed highest reactivity with HBr gas chemistry. A high degree of anisotropic etching of GST films was achieved using HBr/Ar gas mixture at the optimized etch conditions.