Microstructural Evolution of an Ultrafine-grained Cryomilled Al 5083 Alloy During Thermomechanical Processing

• Published in: Journal of materials research Vol. 20; no. 8; pp. 2117 - 2126
• Main Authors: Witkin, David, Han, Bing Q., Lavernia, Enrique J.
• Format: Journal Article
• Language: English
• Published: New York, USA Cambridge University Press 01.08.2005
• Subjects: Cryomilling; Extrusion; Grain growth; Grain growth; Extrusion; Cryomilling
• ISSN: 0884-2914; 2044-5326
• DOI: 10.1557/JMR.2005.0261

The microstructural changes in cryomilled and consolidated Al 5083 following compression testing at several temperatures are described. Prior to testing, the material had an average grain size of approximately 138 nm and exhibited a duplex microstructure, containing coarse grains between 500 and 2000 nm. After uniaxial compressive deformation at temperatures between 423 and 573 K (0.49–0.66 Tm), the average grain size increased to between 200 and 300 nm, consistent with the average grain size of extrusions formed from the same material at similar temperatures. The similarity in grain size distribution following uniaxial compression or extrusion despite differences in total strain and stress state imposed by each indicates that much of the deformation in the extrusion process occurs in coarse-grained regions.