Black silicon – correlation between microstructure and Raman scattering

Black silicon layers were formed on silicon substrate by the surface structure chemical transfer method and by anodic etching method. Properties of microstructure of formed layers were experimentally studied by the electron microscopy methods (TEM) and characterized by statistical, Fourier and multi...

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Published inJournal of Electrical Engineering Vol. 70; no. 7; pp. 58 - 64
Main Authors Jurečka, Stanislav, Pinčík, Emil, Imamura, Kentaro, Matsumoto, Taketoshi, Kobayashi, Hikaru
Format Journal Article
LanguageEnglish
Published Bratislava Sciendo 01.12.2019
De Gruyter Poland
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Abstract Black silicon layers were formed on silicon substrate by the surface structure chemical transfer method and by anodic etching method. Properties of microstructure of formed layers were experimentally studied by the electron microscopy methods (TEM) and characterized by statistical, Fourier and multifractal methods. Theoretical structures with defined fractal properties and surface roughness were generated and their microstructure properties were evaluated. Obtained results were used for the explanation of the real structure development during the forming procedure. By using of this approach, we study the correlation of roughness and fractality with optical properties. Black silicon layers were also investigated by using of Raman scattering method. Optimized theoretical model describing the 1 order of black Si Raman scattering profile was constructed and used for evaluation of the biaxial tensile stress introduced during etching procedure.
AbstractList Black silicon layers were formed on silicon substrate by the surface structure chemical transfer method and by anodic etching method. Properties of microstructure of formed layers were experimentally studied by the electron microscopy methods (TEM) and characterized by statistical, Fourier and multifractal methods. Theoretical structures with defined fractal properties and surface roughness were generated and their microstructure properties were evaluated. Obtained results were used for the explanation of the real structure development during the forming procedure. By using of this approach, we study the correlation of roughness and fractality with optical properties. Black silicon layers were also investigated by using of Raman scattering method. Optimized theoretical model describing the 1st order of black Si Raman scattering profile was constructed and used for evaluation of the biaxial tensile stress introduced during etching procedure.
Black silicon layers were formed on silicon substrate by the surface structure chemical transfer method and by anodic etching method. Properties of microstructure of formed layers were experimentally studied by the electron microscopy methods (TEM) and characterized by statistical, Fourier and multifractal methods. Theoretical structures with defined fractal properties and surface roughness were generated and their microstructure properties were evaluated. Obtained results were used for the explanation of the real structure development during the forming procedure. By using of this approach, we study the correlation of roughness and fractality with optical properties. Black silicon layers were also investigated by using of Raman scattering method. Optimized theoretical model describing the 1 order of black Si Raman scattering profile was constructed and used for evaluation of the biaxial tensile stress introduced during etching procedure.
Black silicon layers were formed on silicon substrate by the surface structure chemical transfer method and by anodic etching method. Properties of microstructure of formed layers were experimentally studied by the electron microscopy methods (TEM) and characterized by statistical, Fourier and multifractal methods. Theoretical structures with defined fractal properties and surface roughness were generated and their microstructure properties were evaluated. Obtained results were used for the explanation of the real structure development during the forming procedure. By using of this approach, we study the correlation of roughness and fractality with optical properties. Black silicon layers were also investigated by using of Raman scattering method. Optimized theoretical model describing the 1 st order of black Si Raman scattering profile was constructed and used for evaluation of the biaxial tensile stress introduced during etching procedure.
Author Jurečka, Stanislav
Kobayashi, Hikaru
Imamura, Kentaro
Matsumoto, Taketoshi
Pinčík, Emil
Author_xml – sequence: 1
  givenname: Stanislav
  surname: Jurečka
  fullname: Jurečka, Stanislav
  email: stanislav.jurecka@feit.uniza.sk
  organization: Institute of Aurel Stodola, University of Žilina, Liptovský Mikuláš, Slovakia
– sequence: 2
  givenname: Emil
  surname: Pinčík
  fullname: Pinčík, Emil
  organization: Institute of Physics SAS, Dúbravská cesta 9, 842 28 Bratislava, Slovakia
– sequence: 3
  givenname: Kentaro
  surname: Imamura
  fullname: Imamura, Kentaro
  organization: The Institute of Scientific and Industrial Research, Osaka University, CREST, Japan Science and Technology Agency, Ibaraki, Osaka 567-0047, Japan
– sequence: 4
  givenname: Taketoshi
  surname: Matsumoto
  fullname: Matsumoto, Taketoshi
  organization: The Institute of Scientific and Industrial Research, Osaka University, CREST, Japan Science and Technology Agency, Ibaraki, Osaka 567-0047, Japan
– sequence: 5
  givenname: Hikaru
  surname: Kobayashi
  fullname: Kobayashi, Hikaru
  organization: The Institute of Scientific and Industrial Research, Osaka University, CREST, Japan Science and Technology Agency, Ibaraki, Osaka 567-0047, Japan
BookMark eNptkE1LAzEQhoNUsNYevS94Xs3mY5N40-JHQRBEwVvIZidl6zZbkyylN_-D_9Bf4pYKevA078A778w8x2jkOw8InRb4nDAhL5YAOcGFyjFm5ACNC0pVTrF6Hf3RR2ga4xJjXDBFGC7HaH7dGvuWxaZtbOezr4_PzHYhQGtSM_QVpA2Az1aNDV1MobepD5AZX2dPZmV8Fq1JCULjFyfo0Jk2wvSnTtDL7c3z7D5_eLybz64eckuFSDkrMWdSEqeAC1lJ7hSmNa95UVEpnBPMOgG1U8oQRSUXpOK8omWleFmK2tIJOtvnrkP33kNMetn1wQ8rNSFKUUawEIMr37t2d8cATq9DszJhqwusd8D0AEzvgOkdsMF_ufdvTDv8U8Mi9NtB_Ib_Oyew4JJ-A7mLc5Q
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ContentType Journal Article
Copyright 2019. This work is published under http://creativecommons.org/licenses/by-nc-nd/4.0 (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.
Copyright_xml – notice: 2019. This work is published under http://creativecommons.org/licenses/by-nc-nd/4.0 (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.
DBID AAYXX
CITATION
7SP
8FD
8FE
8FG
ABJCF
ABUWG
AFKRA
ARAPS
AZQEC
BENPR
BGLVJ
CCPQU
DWQXO
HCIFZ
L6V
L7M
M7S
P5Z
P62
PHGZM
PHGZT
PIMPY
PKEHL
PQEST
PQGLB
PQQKQ
PQUKI
PRINS
PTHSS
DOI 10.2478/jee-2019-0042
DatabaseName CrossRef
Electronics & Communications Abstracts
Technology Research Database
ProQuest SciTech Collection
ProQuest Technology Collection
Materials Science & Engineering Collection
ProQuest Central (Alumni)
ProQuest Central UK/Ireland
ProQuest Advanced Technologies & Aerospace Collection
ProQuest Central Essentials
ProQuest Central
Technology Collection
ProQuest One
ProQuest Central
SciTech Premium Collection
ProQuest Engineering Collection
Advanced Technologies Database with Aerospace
Engineering Database
Advanced Technologies & Aerospace Database
ProQuest Advanced Technologies & Aerospace Collection
ProQuest Central Premium
ProQuest One Academic
Publicly Available Content Database
ProQuest One Academic Middle East (New)
ProQuest One Academic Eastern Edition (DO NOT USE)
ProQuest One Applied & Life Sciences
ProQuest One Academic
ProQuest One Academic UKI Edition
ProQuest Central China
Engineering Collection
DatabaseTitle CrossRef
Publicly Available Content Database
Technology Collection
Technology Research Database
ProQuest One Academic Middle East (New)
ProQuest Advanced Technologies & Aerospace Collection
ProQuest Central Essentials
ProQuest Central (Alumni Edition)
SciTech Premium Collection
ProQuest One Community College
ProQuest Central China
ProQuest Central
ProQuest One Applied & Life Sciences
ProQuest Engineering Collection
ProQuest Central Korea
ProQuest Central (New)
Advanced Technologies Database with Aerospace
Engineering Collection
Advanced Technologies & Aerospace Collection
Engineering Database
ProQuest One Academic Eastern Edition
Electronics & Communications Abstracts
ProQuest Technology Collection
ProQuest SciTech Collection
Advanced Technologies & Aerospace Database
ProQuest One Academic UKI Edition
Materials Science & Engineering Collection
ProQuest One Academic
ProQuest One Academic (New)
DatabaseTitleList Publicly Available Content Database

CrossRef
Database_xml – sequence: 1
  dbid: 8FG
  name: ProQuest Technology Collection
  url: https://search.proquest.com/technologycollection1
  sourceTypes: Aggregation Database
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISSN 1339-309X
EndPage 64
ExternalDocumentID 10_2478_jee_2019_0042
10_2478_jee_2019_004270758
GroupedDBID 0R~
4.4
8FE
8FG
9WM
AATOW
ABFKT
ABJCF
ACGFS
ACIWK
ADBLJ
ADMLS
AFKRA
AHGSO
ALMA_UNASSIGNED_HOLDINGS
ARAPS
BENPR
BGLVJ
CCPQU
E0C
EBS
EJD
HCIFZ
HZ~
KQ8
L6V
M7S
O9-
OK1
P2P
P62
PHGZM
PHGZT
PIMPY
PQGLB
PROAC
PTHSS
QD8
SA.
SLJYH
AAYXX
CITATION
7SP
8FD
ABUWG
AIKXB
AZQEC
DWQXO
L7M
PKEHL
PQEST
PQQKQ
PQUKI
PRINS
ID FETCH-LOGICAL-c377t-46054882f9e578b85f903d5d51b387ff74cf7edf99a2938572b55b36b95667dc3
IEDL.DBID BENPR
ISSN 1339-309X
1335-3632
IngestDate Fri Jul 25 12:07:46 EDT 2025
Sun Jul 06 05:03:10 EDT 2025
Thu Jul 10 10:37:48 EDT 2025
IsDoiOpenAccess true
IsOpenAccess true
IsPeerReviewed true
IsScholarly true
Issue 7
Language English
License This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.
http://creativecommons.org/licenses/by-nc-nd/4.0
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c377t-46054882f9e578b85f903d5d51b387ff74cf7edf99a2938572b55b36b95667dc3
Notes ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 14
OpenAccessLink https://www.proquest.com/docview/2299342077?pq-origsite=%requestingapplication%
PQID 2299342077
PQPubID 2026551
PageCount 7
ParticipantIDs proquest_journals_2299342077
crossref_primary_10_2478_jee_2019_0042
walterdegruyter_journals_10_2478_jee_2019_004270758
PublicationCentury 2000
PublicationDate 2019-12-01
PublicationDateYYYYMMDD 2019-12-01
PublicationDate_xml – month: 12
  year: 2019
  text: 2019-12-01
  day: 01
PublicationDecade 2010
PublicationPlace Bratislava
PublicationPlace_xml – name: Bratislava
PublicationTitle Journal of Electrical Engineering
PublicationYear 2019
Publisher Sciendo
De Gruyter Poland
Publisher_xml – name: Sciendo
– name: De Gruyter Poland
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SSID ssj0001492406
Score 2.1393514
Snippet Black silicon layers were formed on silicon substrate by the surface structure chemical transfer method and by anodic etching method. Properties of...
SourceID proquest
crossref
walterdegruyter
SourceType Aggregation Database
Index Database
Publisher
StartPage 58
SubjectTerms Axial stress
black silicon
Correlation analysis
Etching
fractal properties
Microstructure
Optical properties
Organic chemistry
Raman scattering
Raman spectra
roughness
Silicon substrates
Surface roughness
Surface structure
TEM
Tensile stress
Title Black silicon – correlation between microstructure and Raman scattering
URI https://www.degruyter.com/doi/10.2478/jee-2019-0042
https://www.proquest.com/docview/2299342077
Volume 70
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LSwMxEB5svehBfGK1Sg7ibel2k2yyJ1GxPsAiouBtyVMUXbUPxJv_wX_oL3Gyu6Uq4j3M4Ztk5ptHZgB2TKpTb7sKw1RmI6azbpS5zEVI9a1hyqmEhY_C5_305Jqd3fCbOuE2rNsqJzaxNNT2yYQceSdBu0lZEgux9_wSha1Robpar9BowCyaYCmbMHtw1L-4nGZZWBZcVhl1UR7RlCbVoM2ECdm5dw5vSfjFE7Pkp2Oass2F17Jubd3tYPw2mtRJS_fTW4SFmjeS_UrRSzDjimWY_zZNcAVOy2QcGd49oHYL8vn-QUzYvVF1u5G6I4s8hha8amzseOCIKiy5VI-qIENTztpEWatw3Tu6OjyJ6k0JkaFCjKJQ3MSXmPjM4QvUkvssppZb3tVUCu8FM14467NMoXuXXCSac01TjdFRKqyha9Asngq3DkQwb6wXsRY6ZppjNMaVlrFSVjHkVmkLdicw5c_VQIwcA4mAZ4545gHPPODZgvYExLx-F8N8qsUW0F_ATk_9KU8guZEb_wvdhLlSn2W7SRuaiKXbQtIw0tvQkL3j7fp-fAEEWcLE
linkProvider ProQuest
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwtV25TtxAGP7FUQQKxJGITTimADoL7xweu4iiCFh2uQoEEp0zJyLKmmMXIbq8Q94jD5UnyT_jtRYQoqO3_uKbz_99AGyYTGfethWGqdwmXBftpHCFS9DVt4YrpygPg8LHJ1n3nB9ciIsJ-NvMwoS2ykYnRkVtr03IkW9T1JuM01TKbze3SbgaFaqrzQmNmhaH7vEBQ7bB194uvu8mpZ29s51uMroqkBgm5TAJhUBkLfWFQ7bqXPgiZVZY0dYsl95Lbrx01heFQlOYC0m1EJplGiOJTFrDUO4kTHOGljxMpnf2xzkdXgQDGWM8JhKWMVqv9aRc5ts_nUNOhpmhlNPnZnDs2849xCq5dZd394_DpiobjV1nHuZGXir5XtNqASZctQizT3YXLkEvpv7I4OoXcqki_37_ISZc-qh768io_4v0Q8NfvaT2_s4RVVlyqvqqIgMTN3uirI9w_i4IfoKp6rpyy0Ak98Z6mWqpU64Fxn5C6TxVyiqOnlzWgq0GpvKmXr9RYtgS8CwRzzLgWQY8W7DSgFiO_sJBOeZMC9gLYMdfvSpPoiuVf35b6Dp86J4dH5VHvZPDLzAT3zY2uqzAFOLqVtFdGeq1yBECP96blP8BC0X8Kg
linkToPdf http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV3JTsMwELWgSAgOFasoFPABcYuaJnYcHyugtCwFAZV6i-zYRiAaqi5C3PgH_pAvYeykKtuJe-zDm3HmjWfmGaGDNJKRUXUBaSpRHpG87nHNtQdUX6VEaBEQOyh82YlaXXLWo71iWN3Owrj_vnLVytpAGdeqTFhce9QaDGoHbsDL5tECozwAh15otE5vr2aXKoTbCJVraf5e9z32zAhl-cWVppW-H05ex9NSqIswzRVULqghbuS2XEVzOltDy18EA9dR29234dHDExgwwx9v7zi1z2vkDW24aLrCfdtllyvDToYai0zhG9EXGR6lTk4T9tpA3ebJ3VHLKx5D8NKQsbFn65dw2ALDNRwyGVPD_VBRResyjJkxjKSGaWU4FxDBY8oCSakMIwkJUMRUGm6iUvac6S2EGTGpMsyXTPpEUki4qJCxL4QSBOhTVEGHU5iSQa55kUCuYPFMAM_E4plYPCuoOgUxKVx_lAQQ4EIS-IxVUPgD2NlXf-7HgL_E2_9atY8Wr4-byUW7c76DlpzFXc9JFZUAbb0LzGEs9wp_-QRabMEm
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Black+silicon+%E2%80%93+correlation+between+microstructure+and+Raman+scattering&rft.jtitle=Journal+of+Electrical+Engineering&rft.au=Jure%C4%8Dka%2C+Stanislav&rft.au=Pin%C4%8D%C3%ADk%2C+Emil&rft.au=Imamura%2C+Kentaro&rft.au=Matsumoto%2C+Taketoshi&rft.date=2019-12-01&rft.issn=1339-309X&rft.eissn=1339-309X&rft.volume=70&rft.issue=7&rft.spage=58&rft.epage=64&rft_id=info:doi/10.2478%2Fjee-2019-0042&rft.externalDBID=n%2Fa&rft.externalDocID=10_2478_jee_2019_0042
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1339-309X&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1339-309X&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1339-309X&client=summon