Black silicon – correlation between microstructure and Raman scattering
Black silicon layers were formed on silicon substrate by the surface structure chemical transfer method and by anodic etching method. Properties of microstructure of formed layers were experimentally studied by the electron microscopy methods (TEM) and characterized by statistical, Fourier and multi...
Saved in:
Published in | Journal of Electrical Engineering Vol. 70; no. 7; pp. 58 - 64 |
---|---|
Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
Bratislava
Sciendo
01.12.2019
De Gruyter Poland |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | Black silicon layers were formed on silicon substrate by the surface structure chemical transfer method and by anodic etching method. Properties of microstructure of formed layers were experimentally studied by the electron microscopy methods (TEM) and characterized by statistical, Fourier and multifractal methods. Theoretical structures with defined fractal properties and surface roughness were generated and their microstructure properties were evaluated. Obtained results were used for the explanation of the real structure development during the forming procedure. By using of this approach, we study the correlation of roughness and fractality with optical properties. Black silicon layers were also investigated by using of Raman scattering method. Optimized theoretical model describing the 1
order of black Si Raman scattering profile was constructed and used for evaluation of the biaxial tensile stress introduced during etching procedure. |
---|---|
AbstractList | Black silicon layers were formed on silicon substrate by the surface structure chemical transfer method and by anodic etching method. Properties of microstructure of formed layers were experimentally studied by the electron microscopy methods (TEM) and characterized by statistical, Fourier and multifractal methods. Theoretical structures with defined fractal properties and surface roughness were generated and their microstructure properties were evaluated. Obtained results were used for the explanation of the real structure development during the forming procedure. By using of this approach, we study the correlation of roughness and fractality with optical properties. Black silicon layers were also investigated by using of Raman scattering method. Optimized theoretical model describing the 1st order of black Si Raman scattering profile was constructed and used for evaluation of the biaxial tensile stress introduced during etching procedure. Black silicon layers were formed on silicon substrate by the surface structure chemical transfer method and by anodic etching method. Properties of microstructure of formed layers were experimentally studied by the electron microscopy methods (TEM) and characterized by statistical, Fourier and multifractal methods. Theoretical structures with defined fractal properties and surface roughness were generated and their microstructure properties were evaluated. Obtained results were used for the explanation of the real structure development during the forming procedure. By using of this approach, we study the correlation of roughness and fractality with optical properties. Black silicon layers were also investigated by using of Raman scattering method. Optimized theoretical model describing the 1 order of black Si Raman scattering profile was constructed and used for evaluation of the biaxial tensile stress introduced during etching procedure. Black silicon layers were formed on silicon substrate by the surface structure chemical transfer method and by anodic etching method. Properties of microstructure of formed layers were experimentally studied by the electron microscopy methods (TEM) and characterized by statistical, Fourier and multifractal methods. Theoretical structures with defined fractal properties and surface roughness were generated and their microstructure properties were evaluated. Obtained results were used for the explanation of the real structure development during the forming procedure. By using of this approach, we study the correlation of roughness and fractality with optical properties. Black silicon layers were also investigated by using of Raman scattering method. Optimized theoretical model describing the 1 st order of black Si Raman scattering profile was constructed and used for evaluation of the biaxial tensile stress introduced during etching procedure. |
Author | Jurečka, Stanislav Kobayashi, Hikaru Imamura, Kentaro Matsumoto, Taketoshi Pinčík, Emil |
Author_xml | – sequence: 1 givenname: Stanislav surname: Jurečka fullname: Jurečka, Stanislav email: stanislav.jurecka@feit.uniza.sk organization: Institute of Aurel Stodola, University of Žilina, Liptovský Mikuláš, Slovakia – sequence: 2 givenname: Emil surname: Pinčík fullname: Pinčík, Emil organization: Institute of Physics SAS, Dúbravská cesta 9, 842 28 Bratislava, Slovakia – sequence: 3 givenname: Kentaro surname: Imamura fullname: Imamura, Kentaro organization: The Institute of Scientific and Industrial Research, Osaka University, CREST, Japan Science and Technology Agency, Ibaraki, Osaka 567-0047, Japan – sequence: 4 givenname: Taketoshi surname: Matsumoto fullname: Matsumoto, Taketoshi organization: The Institute of Scientific and Industrial Research, Osaka University, CREST, Japan Science and Technology Agency, Ibaraki, Osaka 567-0047, Japan – sequence: 5 givenname: Hikaru surname: Kobayashi fullname: Kobayashi, Hikaru organization: The Institute of Scientific and Industrial Research, Osaka University, CREST, Japan Science and Technology Agency, Ibaraki, Osaka 567-0047, Japan |
BookMark | eNptkE1LAzEQhoNUsNYevS94Xs3mY5N40-JHQRBEwVvIZidl6zZbkyylN_-D_9Bf4pYKevA078A778w8x2jkOw8InRb4nDAhL5YAOcGFyjFm5ACNC0pVTrF6Hf3RR2ga4xJjXDBFGC7HaH7dGvuWxaZtbOezr4_PzHYhQGtSM_QVpA2Az1aNDV1MobepD5AZX2dPZmV8Fq1JCULjFyfo0Jk2wvSnTtDL7c3z7D5_eLybz64eckuFSDkrMWdSEqeAC1lJ7hSmNa95UVEpnBPMOgG1U8oQRSUXpOK8omWleFmK2tIJOtvnrkP33kNMetn1wQ8rNSFKUUawEIMr37t2d8cATq9DszJhqwusd8D0AEzvgOkdsMF_ufdvTDv8U8Mi9NtB_Ib_Oyew4JJ-A7mLc5Q |
Cites_doi | 10.1002/pip.2867 10.1002/adfm.200900181 10.1037/a0019098 10.1103/PhysRevA.40.5284 10.1021/jp077053o 10.1149/2.010302ssl 10.1021/nl903391x 10.1021/nn303680k 10.1063/1.103561 10.1016/j.solmat.2015.05.006 10.1016/B978-012265655-2/50000-3 10.1016/j.apsusc.2007.10.076 10.1016/j.wear.2007.01.025 10.1016/j.apsusc.2018.03.190 10.1119/1.13295 10.1109/9780470544792 10.1063/1.104512 10.1149/2.0091512ssl 10.1063/1.4813089 10.5772/14860 10.1145/355769.355773 |
ContentType | Journal Article |
Copyright | 2019. This work is published under http://creativecommons.org/licenses/by-nc-nd/4.0 (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. |
Copyright_xml | – notice: 2019. This work is published under http://creativecommons.org/licenses/by-nc-nd/4.0 (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. |
DBID | AAYXX CITATION 7SP 8FD 8FE 8FG ABJCF ABUWG AFKRA ARAPS AZQEC BENPR BGLVJ CCPQU DWQXO HCIFZ L6V L7M M7S P5Z P62 PHGZM PHGZT PIMPY PKEHL PQEST PQGLB PQQKQ PQUKI PRINS PTHSS |
DOI | 10.2478/jee-2019-0042 |
DatabaseName | CrossRef Electronics & Communications Abstracts Technology Research Database ProQuest SciTech Collection ProQuest Technology Collection Materials Science & Engineering Collection ProQuest Central (Alumni) ProQuest Central UK/Ireland ProQuest Advanced Technologies & Aerospace Collection ProQuest Central Essentials ProQuest Central Technology Collection ProQuest One ProQuest Central SciTech Premium Collection ProQuest Engineering Collection Advanced Technologies Database with Aerospace Engineering Database Advanced Technologies & Aerospace Database ProQuest Advanced Technologies & Aerospace Collection ProQuest Central Premium ProQuest One Academic Publicly Available Content Database ProQuest One Academic Middle East (New) ProQuest One Academic Eastern Edition (DO NOT USE) ProQuest One Applied & Life Sciences ProQuest One Academic ProQuest One Academic UKI Edition ProQuest Central China Engineering Collection |
DatabaseTitle | CrossRef Publicly Available Content Database Technology Collection Technology Research Database ProQuest One Academic Middle East (New) ProQuest Advanced Technologies & Aerospace Collection ProQuest Central Essentials ProQuest Central (Alumni Edition) SciTech Premium Collection ProQuest One Community College ProQuest Central China ProQuest Central ProQuest One Applied & Life Sciences ProQuest Engineering Collection ProQuest Central Korea ProQuest Central (New) Advanced Technologies Database with Aerospace Engineering Collection Advanced Technologies & Aerospace Collection Engineering Database ProQuest One Academic Eastern Edition Electronics & Communications Abstracts ProQuest Technology Collection ProQuest SciTech Collection Advanced Technologies & Aerospace Database ProQuest One Academic UKI Edition Materials Science & Engineering Collection ProQuest One Academic ProQuest One Academic (New) |
DatabaseTitleList | Publicly Available Content Database CrossRef |
Database_xml | – sequence: 1 dbid: 8FG name: ProQuest Technology Collection url: https://search.proquest.com/technologycollection1 sourceTypes: Aggregation Database |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering |
EISSN | 1339-309X |
EndPage | 64 |
ExternalDocumentID | 10_2478_jee_2019_0042 10_2478_jee_2019_004270758 |
GroupedDBID | 0R~ 4.4 8FE 8FG 9WM AATOW ABFKT ABJCF ACGFS ACIWK ADBLJ ADMLS AFKRA AHGSO ALMA_UNASSIGNED_HOLDINGS ARAPS BENPR BGLVJ CCPQU E0C EBS EJD HCIFZ HZ~ KQ8 L6V M7S O9- OK1 P2P P62 PHGZM PHGZT PIMPY PQGLB PROAC PTHSS QD8 SA. SLJYH AAYXX CITATION 7SP 8FD ABUWG AIKXB AZQEC DWQXO L7M PKEHL PQEST PQQKQ PQUKI PRINS |
ID | FETCH-LOGICAL-c377t-46054882f9e578b85f903d5d51b387ff74cf7edf99a2938572b55b36b95667dc3 |
IEDL.DBID | BENPR |
ISSN | 1339-309X 1335-3632 |
IngestDate | Fri Jul 25 12:07:46 EDT 2025 Sun Jul 06 05:03:10 EDT 2025 Thu Jul 10 10:37:48 EDT 2025 |
IsDoiOpenAccess | true |
IsOpenAccess | true |
IsPeerReviewed | true |
IsScholarly | true |
Issue | 7 |
Language | English |
License | This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License. http://creativecommons.org/licenses/by-nc-nd/4.0 |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-c377t-46054882f9e578b85f903d5d51b387ff74cf7edf99a2938572b55b36b95667dc3 |
Notes | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 14 |
OpenAccessLink | https://www.proquest.com/docview/2299342077?pq-origsite=%requestingapplication% |
PQID | 2299342077 |
PQPubID | 2026551 |
PageCount | 7 |
ParticipantIDs | proquest_journals_2299342077 crossref_primary_10_2478_jee_2019_0042 walterdegruyter_journals_10_2478_jee_2019_004270758 |
PublicationCentury | 2000 |
PublicationDate | 2019-12-01 |
PublicationDateYYYYMMDD | 2019-12-01 |
PublicationDate_xml | – month: 12 year: 2019 text: 2019-12-01 day: 01 |
PublicationDecade | 2010 |
PublicationPlace | Bratislava |
PublicationPlace_xml | – name: Bratislava |
PublicationTitle | Journal of Electrical Engineering |
PublicationYear | 2019 |
Publisher | Sciendo De Gruyter Poland |
Publisher_xml | – name: Sciendo – name: De Gruyter Poland |
References | 2025051318162146356_j_jee-2019-0042_ref_022_w2aab3b7b7b1b6b1ab1ac22Aa 2025051318162146356_j_jee-2019-0042_ref_007_w2aab3b7b7b1b6b1ab1ab7Aa 2025051318162146356_j_jee-2019-0042_ref_020_w2aab3b7b7b1b6b1ab1ac20Aa 2025051318162146356_j_jee-2019-0042_ref_008_w2aab3b7b7b1b6b1ab1ab8Aa 2025051318162146356_j_jee-2019-0042_ref_003_w2aab3b7b7b1b6b1ab1ab3Aa 2025051318162146356_j_jee-2019-0042_ref_011_w2aab3b7b7b1b6b1ab1ac11Aa 2025051318162146356_j_jee-2019-0042_ref_016_w2aab3b7b7b1b6b1ab1ac16Aa 2025051318162146356_j_jee-2019-0042_ref_006_w2aab3b7b7b1b6b1ab1ab6Aa 2025051318162146356_j_jee-2019-0042_ref_017_w2aab3b7b7b1b6b1ab1ac17Aa 2025051318162146356_j_jee-2019-0042_ref_001_w2aab3b7b7b1b6b1ab1ab1Aa 2025051318162146356_j_jee-2019-0042_ref_002_w2aab3b7b7b1b6b1ab1ab2Aa 2025051318162146356_j_jee-2019-0042_ref_014_w2aab3b7b7b1b6b1ab1ac14Aa 2025051318162146356_j_jee-2019-0042_ref_019_w2aab3b7b7b1b6b1ab1ac19Aa 2025051318162146356_j_jee-2019-0042_ref_005_w2aab3b7b7b1b6b1ab1ab5Aa 2025051318162146356_j_jee-2019-0042_ref_021_w2aab3b7b7b1b6b1ab1ac21Aa 2025051318162146356_j_jee-2019-0042_ref_010_w2aab3b7b7b1b6b1ab1ac10Aa 2025051318162146356_j_jee-2019-0042_ref_023_w2aab3b7b7b1b6b1ab1ac23Aa 2025051318162146356_j_jee-2019-0042_ref_012_w2aab3b7b7b1b6b1ab1ac12Aa 2025051318162146356_j_jee-2019-0042_ref_018_w2aab3b7b7b1b6b1ab1ac18Aa 2025051318162146356_j_jee-2019-0042_ref_015_w2aab3b7b7b1b6b1ab1ac15Aa 2025051318162146356_j_jee-2019-0042_ref_009_w2aab3b7b7b1b6b1ab1ab9Aa 2025051318162146356_j_jee-2019-0042_ref_013_w2aab3b7b7b1b6b1ab1ac13Aa 2025051318162146356_j_jee-2019-0042_ref_004_w2aab3b7b7b1b6b1ab1ab4Aa 2025051318162146356_j_jee-2019-0042_ref_024_w2aab3b7b7b1b6b1ab1ac24Aa |
References_xml | – ident: 2025051318162146356_j_jee-2019-0042_ref_010_w2aab3b7b7b1b6b1ab1ac10Aa doi: 10.1002/pip.2867 – ident: 2025051318162146356_j_jee-2019-0042_ref_001_w2aab3b7b7b1b6b1ab1ab1Aa doi: 10.1002/adfm.200900181 – ident: 2025051318162146356_j_jee-2019-0042_ref_016_w2aab3b7b7b1b6b1ab1ac16Aa doi: 10.1037/a0019098 – ident: 2025051318162146356_j_jee-2019-0042_ref_017_w2aab3b7b7b1b6b1ab1ac17Aa – ident: 2025051318162146356_j_jee-2019-0042_ref_015_w2aab3b7b7b1b6b1ab1ac15Aa doi: 10.1103/PhysRevA.40.5284 – ident: 2025051318162146356_j_jee-2019-0042_ref_002_w2aab3b7b7b1b6b1ab1ab2Aa doi: 10.1021/jp077053o – ident: 2025051318162146356_j_jee-2019-0042_ref_003_w2aab3b7b7b1b6b1ab1ab3Aa doi: 10.1149/2.010302ssl – ident: 2025051318162146356_j_jee-2019-0042_ref_004_w2aab3b7b7b1b6b1ab1ab4Aa doi: 10.1021/nl903391x – ident: 2025051318162146356_j_jee-2019-0042_ref_005_w2aab3b7b7b1b6b1ab1ab5Aa doi: 10.1021/nn303680k – ident: 2025051318162146356_j_jee-2019-0042_ref_006_w2aab3b7b7b1b6b1ab1ab6Aa doi: 10.1063/1.103561 – ident: 2025051318162146356_j_jee-2019-0042_ref_009_w2aab3b7b7b1b6b1ab1ab9Aa doi: 10.1016/j.solmat.2015.05.006 – ident: 2025051318162146356_j_jee-2019-0042_ref_014_w2aab3b7b7b1b6b1ab1ac14Aa doi: 10.1016/B978-012265655-2/50000-3 – ident: 2025051318162146356_j_jee-2019-0042_ref_023_w2aab3b7b7b1b6b1ab1ac23Aa doi: 10.1016/j.apsusc.2007.10.076 – ident: 2025051318162146356_j_jee-2019-0042_ref_018_w2aab3b7b7b1b6b1ab1ac18Aa doi: 10.1016/j.wear.2007.01.025 – ident: 2025051318162146356_j_jee-2019-0042_ref_013_w2aab3b7b7b1b6b1ab1ac13Aa – ident: 2025051318162146356_j_jee-2019-0042_ref_020_w2aab3b7b7b1b6b1ab1ac20Aa doi: 10.1016/j.apsusc.2018.03.190 – ident: 2025051318162146356_j_jee-2019-0042_ref_012_w2aab3b7b7b1b6b1ab1ac12Aa doi: 10.1119/1.13295 – ident: 2025051318162146356_j_jee-2019-0042_ref_021_w2aab3b7b7b1b6b1ab1ac21Aa – ident: 2025051318162146356_j_jee-2019-0042_ref_019_w2aab3b7b7b1b6b1ab1ac19Aa doi: 10.1109/9780470544792 – ident: 2025051318162146356_j_jee-2019-0042_ref_007_w2aab3b7b7b1b6b1ab1ab7Aa doi: 10.1063/1.104512 – ident: 2025051318162146356_j_jee-2019-0042_ref_008_w2aab3b7b7b1b6b1ab1ab8Aa doi: 10.1149/2.0091512ssl – ident: 2025051318162146356_j_jee-2019-0042_ref_011_w2aab3b7b7b1b6b1ab1ac11Aa doi: 10.1063/1.4813089 – ident: 2025051318162146356_j_jee-2019-0042_ref_022_w2aab3b7b7b1b6b1ab1ac22Aa doi: 10.5772/14860 – ident: 2025051318162146356_j_jee-2019-0042_ref_024_w2aab3b7b7b1b6b1ab1ac24Aa doi: 10.1145/355769.355773 |
SSID | ssj0001492406 |
Score | 2.1393514 |
Snippet | Black silicon layers were formed on silicon substrate by the surface structure chemical transfer method and by anodic etching method. Properties of... |
SourceID | proquest crossref walterdegruyter |
SourceType | Aggregation Database Index Database Publisher |
StartPage | 58 |
SubjectTerms | Axial stress black silicon Correlation analysis Etching fractal properties Microstructure Optical properties Organic chemistry Raman scattering Raman spectra roughness Silicon substrates Surface roughness Surface structure TEM Tensile stress |
Title | Black silicon – correlation between microstructure and Raman scattering |
URI | https://www.degruyter.com/doi/10.2478/jee-2019-0042 https://www.proquest.com/docview/2299342077 |
Volume | 70 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LSwMxEB5svehBfGK1Sg7ibel2k2yyJ1GxPsAiouBtyVMUXbUPxJv_wX_oL3Gyu6Uq4j3M4Ztk5ptHZgB2TKpTb7sKw1RmI6azbpS5zEVI9a1hyqmEhY_C5_305Jqd3fCbOuE2rNsqJzaxNNT2yYQceSdBu0lZEgux9_wSha1Robpar9BowCyaYCmbMHtw1L-4nGZZWBZcVhl1UR7RlCbVoM2ECdm5dw5vSfjFE7Pkp2Oass2F17Jubd3tYPw2mtRJS_fTW4SFmjeS_UrRSzDjimWY_zZNcAVOy2QcGd49oHYL8vn-QUzYvVF1u5G6I4s8hha8amzseOCIKiy5VI-qIENTztpEWatw3Tu6OjyJ6k0JkaFCjKJQ3MSXmPjM4QvUkvssppZb3tVUCu8FM14467NMoXuXXCSac01TjdFRKqyha9Asngq3DkQwb6wXsRY6ZppjNMaVlrFSVjHkVmkLdicw5c_VQIwcA4mAZ4545gHPPODZgvYExLx-F8N8qsUW0F_ATk_9KU8guZEb_wvdhLlSn2W7SRuaiKXbQtIw0tvQkL3j7fp-fAEEWcLE |
linkProvider | ProQuest |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwtV25TtxAGP7FUQQKxJGITTimADoL7xweu4iiCFh2uQoEEp0zJyLKmmMXIbq8Q94jD5UnyT_jtRYQoqO3_uKbz_99AGyYTGfethWGqdwmXBftpHCFS9DVt4YrpygPg8LHJ1n3nB9ciIsJ-NvMwoS2ykYnRkVtr03IkW9T1JuM01TKbze3SbgaFaqrzQmNmhaH7vEBQ7bB194uvu8mpZ29s51uMroqkBgm5TAJhUBkLfWFQ7bqXPgiZVZY0dYsl95Lbrx01heFQlOYC0m1EJplGiOJTFrDUO4kTHOGljxMpnf2xzkdXgQDGWM8JhKWMVqv9aRc5ts_nUNOhpmhlNPnZnDs2849xCq5dZd394_DpiobjV1nHuZGXir5XtNqASZctQizT3YXLkEvpv7I4OoXcqki_37_ISZc-qh768io_4v0Q8NfvaT2_s4RVVlyqvqqIgMTN3uirI9w_i4IfoKp6rpyy0Ak98Z6mWqpU64Fxn5C6TxVyiqOnlzWgq0GpvKmXr9RYtgS8CwRzzLgWQY8W7DSgFiO_sJBOeZMC9gLYMdfvSpPoiuVf35b6Dp86J4dH5VHvZPDLzAT3zY2uqzAFOLqVtFdGeq1yBECP96blP8BC0X8Kg |
linkToPdf | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV3JTsMwELWgSAgOFasoFPABcYuaJnYcHyugtCwFAZV6i-zYRiAaqi5C3PgH_pAvYeykKtuJe-zDm3HmjWfmGaGDNJKRUXUBaSpRHpG87nHNtQdUX6VEaBEQOyh82YlaXXLWo71iWN3Owrj_vnLVytpAGdeqTFhce9QaDGoHbsDL5tECozwAh15otE5vr2aXKoTbCJVraf5e9z32zAhl-cWVppW-H05ex9NSqIswzRVULqghbuS2XEVzOltDy18EA9dR29234dHDExgwwx9v7zi1z2vkDW24aLrCfdtllyvDToYai0zhG9EXGR6lTk4T9tpA3ebJ3VHLKx5D8NKQsbFn65dw2ALDNRwyGVPD_VBRResyjJkxjKSGaWU4FxDBY8oCSakMIwkJUMRUGm6iUvac6S2EGTGpMsyXTPpEUki4qJCxL4QSBOhTVEGHU5iSQa55kUCuYPFMAM_E4plYPCuoOgUxKVx_lAQQ4EIS-IxVUPgD2NlXf-7HgL_E2_9atY8Wr4-byUW7c76DlpzFXc9JFZUAbb0LzGEs9wp_-QRabMEm |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Black+silicon+%E2%80%93+correlation+between+microstructure+and+Raman+scattering&rft.jtitle=Journal+of+Electrical+Engineering&rft.au=Jure%C4%8Dka%2C+Stanislav&rft.au=Pin%C4%8D%C3%ADk%2C+Emil&rft.au=Imamura%2C+Kentaro&rft.au=Matsumoto%2C+Taketoshi&rft.date=2019-12-01&rft.issn=1339-309X&rft.eissn=1339-309X&rft.volume=70&rft.issue=7&rft.spage=58&rft.epage=64&rft_id=info:doi/10.2478%2Fjee-2019-0042&rft.externalDBID=n%2Fa&rft.externalDocID=10_2478_jee_2019_0042 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1339-309X&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1339-309X&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1339-309X&client=summon |