An empirical approach to explain the material removal rate for copper chemical mechanical polishing

In this paper, an empirical expression was deduced based on the experimental data for material removal rate of copper chemical mechanical polishing. The parameters of this expression includes the initial chemical corrosion rate(MRR0), the corrosion inhibition efficiency(k) and the mechanical abradin...

Full description

Saved in:
Bibliographic Details
Published inTribology international Vol. 47; pp. 142 - 144
Main Authors Guoshun, Pan, Ning, Wang, Hua, Gong, Yan, Liu
Format Journal Article
LanguageEnglish
Published Kidlington Elsevier Ltd 01.03.2012
Elsevier
Subjects
Applied sciences
BTA
Chelating ligand
Chemical mechanical polishing
Copper
CORROSION
CORROSION INHIBITORS
Corrosion rate
Empirical analysis
Exact sciences and technology
Friction, wear, lubrication
Inhibition
Machine components
Material removal rate
Mechanical engineering. Machine design
MECHANICAL POLISHING
Metals. Metallurgy
MICA
POLISHING
TRIBOLOGY
Chelating ligand
Material removal rate
Chemical mechanical polishing
BTA
Mechanical polishing
Chemical polishing
Particle suspension
Experimental study
Wear rate
Chemical corrosion
Inhibitor
Copper
Slurries
Tribology
Online AccessGet full text

Cover

More Information
Summary:In this paper, an empirical expression was deduced based on the experimental data for material removal rate of copper chemical mechanical polishing. The parameters of this expression includes the initial chemical corrosion rate(MRR0), the corrosion inhibition efficiency(k) and the mechanical abrading rate(MRRM). The deduced empirical expression revealed that under certain slurry systems, the corrosion inhibition efficiency may always keep unchanged, which may be useful to characterize the inhibition properties of different inhibitors.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0301-679X
1879-2464
DOI:10.1016/j.triboint.2011.10.010