High thermoelectric performance of melt-spun CuxBi0.5Sb1.5Te3 by synergetic effect of carrier tuning and phonon engineering

Bi-Te based materials have been used for near-room-temperature thermoelectric applications. However, their properties dramatically decrease at high temperatures (over 100 °C), limiting their use in power generation. In this study, we investigated the enhanced thermoelectric properties of Bi-Te based...

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Bibliographic Details
Published inActa materialia Vol. 158; pp. 289 - 296
Main Authors Yoon, Jeong Seop, Song, Jae Min, Rahman, Jamil Ur, Lee, Soonil, Seo, Won Seon, Lee, Kyu Hyoung, Kim, Seyun, Kim, Hyun-Sik, Kim, Sang-il, Shin, Weon Ho
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.10.2018
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Summary:Bi-Te based materials have been used for near-room-temperature thermoelectric applications. However, their properties dramatically decrease at high temperatures (over 100 °C), limiting their use in power generation. In this study, we investigated the enhanced thermoelectric properties of Bi-Te based materials by Cu doping and employing the melt-spinning (MS) process that can be utilized especially at elevated temperatures. By changing the doping amount, we could modulate the temperature dependence of thermoelectric properties, where the maximum ZT temperature could be shifted from room temperature to 450 K. The highest ZT value, 1.34, was achieved at 400 K for 2% Cu-doped Bi0.5Sb1.5Te3, which is due to the enhancement in power factor and reduction in lattice thermal conductivity. The average ZT value between room temperature and 530 K was 1.17 for 2% Cu-doped Bi0.5Sb1.5Te3, which is 46% higher than that of pristine Bi0.5Sb1.5Te3. Consequently, the synergetic effect of MS process and Cu incorporation can be a promising method to widen the application of Bi-Te based thermoelectric materials for mid-temperature power generation. The combined effect of melt-spinning process and Cu incorporation gives to widen Bi-Te-based thermoelectric materials for mid-temperature power generation. [Display omitted]
ISSN:1359-6454
1873-2453
DOI:10.1016/j.actamat.2018.07.067