Microstructure and mechanical properties of Sn–Zn–Bi–Cr lead-free solder

In this paper, the effect of trace addition of Cr on the mechanical properties and reliability on Sn–8Zn–3Bi solder alloys was investigated. It has been demonstrated that the microstructure of solder alloys was refined after doping traces of Cr. The elongation reaches up to 40.63% after doping 0.1%...

Full description

Saved in:
Bibliographic Details
Published inMicroelectronics and reliability Vol. 52; no. 3; pp. 585 - 588
Main Authors Luo, Tingbi, Hu, Anmin, Hu, Jing, Li, Ming, Mao, Dali
Format Journal Article
LanguageEnglish
Published Kidlington Elsevier Ltd 01.03.2012
Elsevier
Subjects
Alloys
Applied sciences
Chromium
Design. Technologies. Operation analysis. Testing
Doping
Electronics
Exact sciences and technology
Fracture mechanics
Integrated circuits
Mechanical properties
Microstructure
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Solders
Tin base alloys
Integrated circuit bonding
Ageing
Doping
Rupture
Lead free soldering
Mechanical properties
Solder metal
Reliability
Microstructure
Zinc
Online AccessGet full text

Cover

More Information
Summary:In this paper, the effect of trace addition of Cr on the mechanical properties and reliability on Sn–8Zn–3Bi solder alloys was investigated. It has been demonstrated that the microstructure of solder alloys was refined after doping traces of Cr. The elongation reaches up to 40.63% after doping 0.1% Cr; and the fracture mechanism converts from quasi-cleavage fracture into ductile fracture. With aging time of 0, 4, 9 and 16days, mechanical property of Sn–8Zn–3Bi–0.3Cr alloy was improved slightly. It was found that the Sn–Zn–Cr phase was increased and Zn in alloy was consumed after aging, so that the amount of primary Zn phase was reduced and microstructure was improved.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0026-2714
1872-941X
DOI:10.1016/j.microrel.2011.10.005