Residual Stress in Copper Containing a High Concentration of Krypton Precipitates

• Published in: Advanced engineering materials Vol. 4; no. 8; pp. 592 - 595
• Main Authors: Härting, M., Yaman, M., Bucher, R., Britton, D.T.
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Weinheim WILEY-VCH Verlag 01.08.2002; WILEY‐VCH Verlag; Wiley-VCH
• Subjects: Analysing. Testing. Standards; Applied sciences; Exact sciences and technology; ion implantation; Metals. Metallurgy; residual stress; spherical precipitates; Stress analysis; Stress analysis; FCC lattices; Pressure effect; Impurity; Transition metal; Precipitate; Copper; Experimental study; X ray diffraction; Krypton additions; Residual stress
• ISSN: 1438-1656; 1527-2648
• DOI: 10.1002/1527-2648(20020806)4:8<592::AID-ADEM592>3.0.CO;2-2

A study of the residual stress and bubble pressure in bulk samples of copper, containing 3 at.‐% krypton, using X‐ray diffraction techniques is presented here. The authors have confirmed that the Kr forms solid precipitates with an fcc structure, which is consistent with an estimated pressure of 2.4 GPa. Stress measurements in the surrounding Cu matrix indicate a zero normal stress, confirming that the matrix experiences only a shear strain. The magnitude of the shear stress is estimated from the bubble pressure to be below the yield stress of the matrix, thus explaining the long term stability of the bubbles.