Standard and self-sustained magnetron sputtering deposited Cu films investigated by means of AFM and XRD

• Published in: Microelectronics and reliability Vol. 51; no. 7; pp. 1203 - 1206
• Main Authors: Wiatrowski, A., Posadowski, W.M., Jóźwiak, G., Serafińczuk, J., Szeloch, R., Gotszalk, T.
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Kidlington Elsevier Ltd 01.07.2011; Elsevier
• Subjects: Applied sciences; Argon; Copper; Cross-disciplinary physics: materials science; rheology; Crystallites; Deposition; Deposition by sputtering; Direct current; Electronic tubes, masers; Electronics; Exact sciences and technology; Magnetron sputtering; Materials science; Methods of deposition of films and coatings; film growth and epitaxy; Physics; Silicon substrates; Microwave tubes; Atomic force microscopy; XRD; Surface structure; Thin films; Magnetrons; Cathode sputtering; Manufacturing processes; Direct current; Argon; Copper; Microstructure; Comparative study
• ISSN: 0026-2714; 1872-941X
• DOI: 10.1016/j.microrel.2011.02.024

The goal of conducted investigations was to study microstructure and surface morphology of copper thin films deposited during standard (with argon) and self-sustained (without argon presence) magnetron sputtering deposition processes. Different types of magnetron source powering were used: direct current (DC), medium frequency (MF), pulsed-DC. The investigated copper films were deposited by means of balanced magnetron sputtering source on Si (1 1 1) substrates. The results of investigations showed that the average size of the copper crystallites of all samples were equal to dozens of nanometre. However, the self-sustained sputtering deposition processes, in comparison to the standard ones, resulted in smoother film surface.