C-doped GaN buffer layers with high breakdown voltages for high-power operation AlGaN/GaN HFETs on 4-in Si substrates by MOVPE

We investigated GaN buffer layers grown on Si substrates using a multi-wafer metalorganic vapor-phase epitaxy (MOVPE) system for 4-in five wafers (5×4″) growth in order to obtain field-effect transistors (FETs) with high breakdown voltages. It was confirmed that GaN films with smooth surfaces and wi...

Full description

Saved in:
Bibliographic Details
Published inJournal of crystal growth Vol. 298; pp. 831 - 834
Main Authors Kato, Sadahiro, Satoh, Yoshihiro, Sasaki, Hitoshi, Masayuki, Iwami, Yoshida, Seikoh
Format Journal Article Conference Proceeding
LanguageEnglish
Published Amsterdam Elsevier B.V 2007
Elsevier
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:We investigated GaN buffer layers grown on Si substrates using a multi-wafer metalorganic vapor-phase epitaxy (MOVPE) system for 4-in five wafers (5×4″) growth in order to obtain field-effect transistors (FETs) with high breakdown voltages. It was confirmed that GaN films with smooth surfaces and without any cracks were obtained. To obtain high-resistive GaN buffer layers, C-doping was carried out by controlling the V/III ratio and the growth pressure. The breakdown voltage of the buffer layer was strongly correlated with the C concentration. As a result, the breakdown voltage was over 800 V when the C concentration was about 8E18 cm −3. We also fabricated a heterojunction FET (HFET) using an AlGaN/GaN heterostructure on a C-doped GaN buffer layer. The breakdown voltage of the FET in the off state was over 500 V and the maximum drain current of the FET was over 300 mA/mm. It was thus confirmed that an AlGaN/GaN HFET with a high-resistive buffer layer on a 4-in Si substrate could be obtained.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0022-0248
1873-5002
DOI:10.1016/j.jcrysgro.2006.10.192