Connectivity and flux pinning improvements in Ag-clad BSCCO-2223 tapes produced by changes in the cooling rate

• Published in: Journal of materials research Vol. 12; no. 11; pp. 2997 - 3008
• Main Authors: Parrell, J. A., Larbalestier, D. C., Riley, G. N., Li, Q., Carter, W. L., Parrella, R. D., Teplitsky, M.
• Format: Journal Article
• Language: English
• Published: New York, USA Cambridge University Press 01.11.1997
• ISSN: 0884-2914; 2044-5326
• DOI: 10.1557/JMR.1997.0394

The rate at which Ag-clad (Bi, Pb)2Sr2Ca2Cu3Ox tapes are cooled from their final reaction heat treatment influences both the intergranular connectivity and intragranular flux pinning strength of the polycrystalline filaments. As the cooling rate from 825 °C to 730 °C in 7.5% O2 was decreased over a range of 5 °C/min to 0.005 °C/min, Jc (77 K, 0 T) increased from ∼8 to ∼24 kA/cm2, and the irreversibility field increased from, ∼120 to, ∼200 mT. The Jc (4.2 K, 0 T) increased in a similar fashion. Cooling slowly also sharpened the critical temperature transition and increased the critical onset temperature from 107 K to 109 K. These improvements in the superconducting properties occurred despite partial decomposition of the (Bi, Pb)2Sr2Ca2Cu3Ox phase into non-superconducting impurity phases during the slow cooling. A microstructural basis for these multiple effects is described.